Nanowire Segmentation for Surface Tension Stress
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Solution Overview
Problem
The miniaturization of semiconductor devices leads to increased surface tension, causing nano wires to bend or break due to stress, making it difficult to manufacture nano wires and semiconductor devices with narrower widths.
Innovation Solution
Incorporating a wire structure with alternating wider regions to support narrower sections, forming a zigzag pattern at ends and between ends of the wires, which helps distribute stress and prevent bending or breaking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the width of wires is decreased to achieve higher integration, then device integration is improved, but the wires become easily bent or broken due to increased surface tension effect
Solution Approach 1:
The wire is divided into multiple sections with different widths: narrow sections (first width) for high integration and wide sections (second width greater than first width) positioned at intervals to provide mechanical support. This segmentation allows the wire to maintain both high integration in critical areas and sufficient strength in support areas, preventing bending and breaking while achieving higher device integration.
2Manufacturing precision
If the width of wires is decreased to tens of nanometers, then integration is improved, but the effect of surface tension largely increases causing stress and wire failure
Solution Approach 1:
Different sections of the wire are given different width properties: sections requiring high precision and integration maintain narrow width (tens of nanometers), while sections requiring mechanical strength are given wider width to reduce surface tension effects. This local differentiation allows the wire to achieve precise manufacturing control in critical areas while resisting surface tension-induced stress in support areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents nano wires from bending or breaking, allowing for the easy manufacturing of semiconductor devices with nano wires as narrow as 50 nm or less by distributing stress across wider supportive regions.
Implementation Method 1
the effect of surface tension on the wires largely increases. As the effect of surface tension increases, a great stress may be applied to a certain region of the wires
Data Source
AI summary
Provided are a wire structure and a semiconductor device having the wire structure. The wire structure includes a first wire that has a first region having a width of several to tens of nanometers and a second region having a width wider than that of the first region.