Nanowire Sensor Connection to Metal Carrier via Joule Heating
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Solution Overview
Problem
Current methods for connecting temperature or heating sensor elements to carrier elements, such as soldering, silver sintering, and bonding with adhesives, face issues like stress induction, limited temperature resistance, and the need for special equipment, which affect accuracy and productivity.
Innovation Solution
A method using nanowires on the connection surface of the device, which is brought into contact with a metallic carrier element and heated electrically to create a mechanically stable, non-detachable connection, capable of withstanding high temperatures up to 1500 °C, without requiring special equipment, using in-situ temperature treatment by the device itself.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If soldering is used to connect the device to the carrier element, then a mechanical connection is established, but volume shrinkage during solidification induces stresses affecting TCR and temperature accuracy
Solution Approach 1:
The patent extracts the harmful solidification shrinkage process from the connection method by replacing soldering with a nanowire-based mechanical interlocking mechanism. The nanowires on the connection surface mechanically interlock with the carrier element without undergoing phase change, eliminating stress induction while maintaining connection strength.
Solution Approach 2:
The patent introduces nanowires as an intermediary structure on the connection surface that mediates between the device and carrier element. These nanowires create a mechanical interlocking effect that provides strong bonding without the harmful effects of traditional soldering, including stress and flux contamination.
2Reliability
If traditional bonding methods are used, then connection is achieved, but temperature resistance is limited to approximately 300-400 °C
Solution Approach 1:
The patent changes the material parameters of the connection interface by using nanowires with specific material properties (such as tungsten, molybdenum, or nickel-based materials) that maintain structural integrity at high temperatures up to 1500 °C, overcoming the temperature limitations of traditional bonding materials.
3Strength
If the Hook and Loop welding method with nanowires is used, then a mechanically stable connection is created, but external heat treatment in a reflow oven is required which is impractical for larger components
Solution Approach 1:
The patent enables the device to heat itself through its own functional layer when electrical power is applied. This self-heating capability eliminates the need for external reflow ovens or specialized heating equipment, allowing the nanowire connection to be activated in-situ at the application location.
Solution Approach 2:
The patent makes the functional layer serve a dual purpose: its primary function (temperature sensing or heating) and a secondary function of providing in-situ heat treatment for the nanowire connection. This multi-functionality eliminates the need for separate connection equipment.
4Strength
If soldering or traditional bonding is used, then connection is established, but flux can poison the sensor element
Solution Approach 1:
The patent extracts the harmful flux substance from the connection process by replacing chemical bonding methods with a mechanical nanowire interlocking mechanism. This eliminates flux contamination and poisoning of the sensor element while maintaining connection stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method provides a thermally stable connection that is resistant to high temperatures and does not require special equipment, allowing for reliable use in various applications, including those where temperature changes occur, while maintaining the accuracy and stability of the sensor elements.
Implementation Method 1
applying electrical power to the device to emit heat in order to establish a non-releasable connection between the connection surface of the device and the surface of the carrier element
Data Source
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AI summary
The invention comprises a method for connecting an apparatus (1) to a carrier element (2), wherein the apparatus (1) is a temperature sensor element or a heating element and wherein the apparatus (1) has a connection face (130), the carrier element (2) consisting of a metal material, said method comprising: - providing a plurality of nano-wires on the connection face (130); - joining the apparatus (1) to the carrier element (2) such that the plurality of nano-wires of the connection face (130) are brought into contact with a surface of the carrier element (2); and - applying an electrical power for emission of heat to the apparatus (1) in order to produce an inseparable connection between the connection face (130) of the apparatus (1) and the surface of the carrier element (2), and an apparatus (1), which is designed to carry out the method according to the invention.