Nanowire Substrate Assembly for Robust Semiconductor Mounting
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Solution Overview
Problem
There is a need for a substrate arrangement that allows for the secure and simple mounting of elements in power semiconductor modules, as existing methods require multiple steps and may not provide a robust connection between the semiconductor components and the substrate.
Innovation Solution
A substrate arrangement featuring a first metallization layer with evenly distributed nanowires, where a subset of these nanowires forms a permanent connection between the metallization layer and semiconductor components, and an encapsulant, such as silicone gel, fills gaps between the nanowires to enhance the connection's stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional mounting methods are used to connect semiconductor components to substrate, then connection can be established, but the mounting process requires multiple steps and does not provide robust connection
Solution Approach 1:
The connection structure is segmented into distinct functional zones: nanowires for electrical connection, encapsulant for mechanical bonding and protection, and separate mounting regions. This segmentation allows each element to be optimized independently while simplifying the overall mounting process.
Solution Approach 2:
The patent merges multiple functions into a single integrated connection structure where nanowires provide both electrical conductivity and mechanical anchoring, while the encapsulant simultaneously bonds components to the substrate and provides environmental protection, eliminating the need for separate mounting steps.
2Reliability
If multiple mounting steps are used to securely connect components, then connection reliability improves, but manufacturing complexity and time increase
Solution Approach 1:
The nanowires are pre-formed on the substrate before component placement, creating ready-to-use connection points that guide component positioning and enable direct attachment without requiring separate alignment or bonding steps during assembly.
Solution Approach 2:
The encapsulant material automatically fills gaps and voids between components and substrate during curing, self-adjusting to ensure complete coverage and secure bonding without requiring precise manual positioning or additional sealing operations.
3Strength
If nanowires are used to form permanent connection, then connection strength increases, but gaps between nanowires may reduce structural stability
Solution Approach 1:
The connection structure uses a composite system combining discrete nanowires for electrical conductivity with a continuous encapsulant matrix for mechanical support. This composite approach allows the nanowires to provide strong electrical bonds while the encapsulant fills interstitial spaces to maintain overall structural integrity.
Solution Approach 2:
The encapsulant acts as an intermediary material that bridges the spaces between individually connected nanowires, providing continuous mechanical support and distributing stresses across the entire connection area, thereby stabilizing the structure without interfering with the nanowire electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables secure and flexible mounting of semiconductor components on the substrate with reduced complexity and increased reliability, as the nanowires provide a robust connection and the encapsulant fills gaps, protecting against environmental and mechanical damage.
Implementation Method 1
a first subset of the plurality of nanowires is arranged between the first metallization layer and the at least one component... the second end of each nanowire of the first subset is inseparably connected to a surface of one of the at least one component such that the first subset of nanowires forms a permanent connection
Implementation Method 2
the encapsulant directly adjoins the second ends of a second subset of the plurality of nanowires and fills any gaps and spaces between the nanowires of the second subset
Data Source
Figure 1~3B
Figure 4~5C
Figure 6A~6C
AI summary
A substrate arrangement comprises a first metallization layer (111), a plurality of nanowires (612) arranged on a surface of the first metallization layer (111), and at least one component (20, 4) arranged on the first metallization layer (111) such that a first subset of the plurality of nanowires (612) is arranged between the first metallization layer (111) and the at least one component (20, 4), wherein the plurality of nanowires (612) is evenly distributed over a section of the surface area or over the entire surface area of the first metallization layer (111), each of the plurality of nanowires (612) comprises a first end and a second end, wherein the first end of each of the plurality nanowires (612) is inseparably connected to the surface of the first metallization layer (111), the second end of each nanowire of the first subset is inseparably connected to a surface of one of the at least one component (20, 4) such that the first subset of nanowires (612) forms a permanent connection between the first metallization layer (111) and the at least one component (20, 4), the at least one component (20, 4) comprises at least one semiconductor body (20), and the number of nanowires (612) comprised in the first subset of nanowires (612) is less than the number of nanowires (612) comprised in the plurality of nanowires.