Narrow Border Display Screen Manufacturing Method
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Solution Overview
Problem
Conventional display devices have wider borders and lower screen-to-body ratios due to the need for space in non-display areas for wire bonding of driving modules and circuit boards, which hinders the design of narrow border displays.
Innovation Solution
A manufacturing method involving a first glass substrate with a display and non-display portion, where a flexible base material is coated, heated, and bent to reduce the non-display area, incorporating a thin film transistor layer and color filter layer, and integrating circuit chips to form liquid crystal panels, thereby reducing the non-display area and increasing the screen-to-body ratio.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If enough space is preserved in non-display area for wire bonding, then driving modules and circuit boards can be bonded and connected, but the non-display area becomes larger which is adverse to narrow border design
Solution Approach 1:
The patent moves the integrated circuit chip from the traditional planar position on the display panel to the edge of the display panel, utilizing the third dimension (edge space) rather than consuming additional non-display area. This dimensional transition allows wire bonding to occur at the panel edge, preserving the non-display area while maintaining connection reliability.
Solution Approach 2:
The patent extracts the integrated circuit chip and wire bonding process from the traditional non-display area location and relocates them to the edge of the display panel. This separation allows the non-display area to be minimized while the edge region handles the connection functions, resolving the contradiction between connection needs and narrow border design.
2Area of stationary object
If non-display area is reduced for narrow border design, then screen-to-body ratio increases, but space for wire bonding and connection of driving modules becomes insufficient
Solution Approach 1:
The patent relocates the wire bonding operation from the face plane of the display panel to the edge dimension. By positioning the integrated circuit chip at the panel edge and performing wire bonding in this edge region, the patent maintains manufacturing accessibility while minimizing the non-display area on the panel face, thus achieving narrow border design without compromising ease of manufacture.
Solution Approach 2:
The patent introduces an edge region as an intermediary zone between the display area and the external connection environment. This edge region serves as a mediator that accommodates the integrated circuit chip and wire bonding processes, allowing connections to be made without requiring additional non-display area on the panel face, thereby maintaining both narrow borders and manufacturing ease.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively reduces the non-display area by utilizing a bendable flexible substrate to reposition integrated circuit chips, significantly enhancing the screen-to-body ratio of the display device.
Implementation Method 1
heating and baking the flexible base material to form a flexible substrate
Data Source
AI summary
The present disclosure replace the unbendable glass substrate of the non-display portion of the first glass substrate connected to the integrated circuit chip with a bendable flexible substrate, and bend the bending portion of the flexible substrate and the integrated circuit chip connected therewith to the side or the back of the glass substrate, thereby reduce the area of the non-display portion and significantly increase the screen-to-body ratio of the display portion.