Narrow Border Touch Panel via Perpendicular Bonding Surface

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Solution Overview

Problem

Conventional touch panels face challenges in reducing the border dimension due to the expansion of the shielding layer, which affects the effective reduction of the sensing device's border dimension.

Innovation Solution

The touch panel design features a substrate with a main plane and a non-active region, where the bonding surface of the flexible printed circuit board is not parallel to the main plane, allowing connecting lines to be located in the non-active region, and a flexible transparent film that connects to both planes, reducing the bonding region and thus the border dimension.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a shielding layer is used to shield the peripheral circuit and bonding region, then electromagnetic interference is reduced, but the border dimension of the sensing device increases

Engineering Contradiction:
Improveelectromagnetic interferenceVSAvoidborder dimension
Core Design Contradiction:
Object-affected harmful factorsVSLength of stationary object

Solution Approach 1:

The patent moves the bonding region from the main plane (2D surface) to the side surface (3D vertical dimension) of the substrate. By making the bonding surface perpendicular to the main plane, the connecting lines are routed vertically along the side surface rather than horizontally across the main plane, effectively removing the bonding region from the 2D border dimension while maintaining electromagnetic shielding on the main plane.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If the bonding region is expanded to accommodate the flexible printed circuit board connection, then electrical connection is improved, but the border dimension of the sensing device increases

Engineering Contradiction:
Improveelectrical connectionVSAvoidborder dimension
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

The bonding surface is positioned on the side surface of the substrate perpendicular to the main plane, transferring the electrical connection function from the 2D main plane to the 3D vertical dimension. This allows the flexible printed circuit board to connect to the sensing device through the side surface, eliminating the need for horizontal bonding regions that would increase the border dimension.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Length of stationary object

If the shielding layer range is reduced to achieve narrow border, then border dimension is reduced, but electromagnetic shielding effectiveness is compromised

Engineering Contradiction:
Improveborder dimensionVSAvoidelectromagnetic interference
Core Design Contradiction:
Length of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The patent maintains effective electromagnetic shielding on the main plane by positioning the bonding region on the perpendicular side surface. This spatial separation ensures that the shielding layer on the main plane does not need to extend into the border area, as the bonding region is located in a different dimensional plane, thus achieving narrow border while maintaining shielding effectiveness.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent segments the substrate into distinct functional regions: the main plane for sensing and shielding functions, and the side surface for bonding and electrical connection functions. This segmentation allows the shielding layer to be confined to the main plane without needing to extend to the border area, achieving both narrow border and effective shielding.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS9454273B2Touch panel with narrow border
Publication Date: 2016.09.27 HANNSTOUCH SOLUTION
  • US9454273B2 patent drawing
  • US9454273B2 patent drawing
  • US9454273B2 patent drawing

AI summary

A touch panel includes a substrate, a flexible printed circuit board and a sensing device. The substrate includes a main plane having an active region and a non-active region surrounding the active region. The flexible printed circuit board has a bonding surface, wherein the bonding surface and the main plane are not parallel to each other. The sensing device includes a plurality of electrode patterns located in the active region and a plurality of connecting lines respectively connected between the electrode patterns and the flexible printed circuit board so as to electrically connect the electrode patterns and the flexible printed circuit board, wherein at least a part of the connecting lines is located in the non-active region, and the connecting lines are connected to the bonding surface of the flexible printed circuit board.