Narrow Track Width Thin-Film Magnetic Head via Trench Patterning
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Solution Overview
Problem
Conventional methods for forming thin-film magnetic heads with narrower track widths are limited by the resolution of exposure machines and resist, leading to difficulties in achieving track widths below 0.2 μm and potential deterioration of magnetic characteristics due to etching processes.
Innovation Solution
A method involving the formation of a trench-forming film with a minimum width smaller than the resolution limit, using a base layer, first and second frame layers, and a trench-forming film to create a pattern film without relying on etching, followed by chemical mechanical polishing to achieve a narrower track width for the magnetic pole layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional photolithography and etching methods are used, then manufacturing process is relatively simple, but track width cannot be narrowed below 0.2 μm due to resolution limits
Solution Approach 1:
The manufacturing process is divided into multiple sequential steps: forming a first frame layer with width W1, forming a second frame layer with width W2 (>W1) directly above it, then forming a trench-forming film to create a trench with minimum width W3. This segmentation allows each step to work within achievable resolution limits while the cumulative effect achieves sub-0.2 μm track width that would be impossible in a single step.
Solution Approach 2:
The invention transitions from two-dimensional planar patterning to three-dimensional vertical structuring. By stacking frame layers in the vertical dimension and using the trench-forming film to create depth, the process achieves narrow track widths through vertical layering rather than relying solely on horizontal resolution, effectively moving the precision requirement from the lateral to the vertical dimension.
2Manufacturing precision
If etching methods such as ion milling are used to narrow track width, then track width can be reduced, but magnetic characteristics deteriorate due to ion impact on the magnetic pole layer surface
Solution Approach 1:
The invention extracts and removes the harmful etching step from the manufacturing process. By using frame layers and trench-forming films to define the pattern geometry through deposition and mechanical structure rather than material removal, the process eliminates ion beam exposure to the magnetic pole layer, thereby preserving magnetic characteristics while still achieving narrow track widths.
Solution Approach 2:
The frame layers and trench-forming film act as intermediary structures that define the final track width without directly exposing the magnetic pole layer to damaging processes. These intermediary layers serve as masks and structural guides that enable precise pattern formation through non-damaging deposition and polishing processes.
3Productivity
If additional etching processes are used to achieve narrower track width, then recording density can be increased, but manufacturing complexity and process steps increase
Solution Approach 1:
The frame layers and trench-forming film are formed in advance with precise dimensions before the magnetic pole layer is deposited. This preliminary structuring establishes the exact track width geometry beforehand, eliminating the need for subsequent etching steps to achieve the desired narrow width, thereby increasing recording density without adding process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the manufacture of thin-film magnetic heads with track widths narrower than the resolution limit of exposure machines and resist, enhancing recording density without compromising magnetic characteristics, and preventing unnecessary writing to adjacent tracks.
Implementation Method 1
forming a trench-forming film provided with a trench having a minimum width W3 which is smaller than the width W1
Implementation Method 2
chemical mechanical polishing to achieve a narrower track width for the magnetic pole layers
Data Source
AI summary
A method for forming a pattern film with a narrower width than the resolution of an exposure machine and a resist used independently of etching is provided. The method comprises the steps of: forming a first frame layer having end surfaces facing each other across a space having a width W1; forming a second frame layer having end surfaces facing each other across a space having a width W2 that is larger than the width W1, the space having the width W2 being located right above the space having the width W1; forming a trench-forming film provided with a trench having a minimum width W3 that is smaller than the width W1 so as to fill at least a part of the spaces having the width W1 and the width W2 respectively; and forming a pattern film so as to fill at least a part of the trench.