Nb/Ti Cable Electroplating for Solderable Coax Connectors
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Niobium titanium (Nb/Ti) forms a tough, hard oxide layer when heated, preventing normal soldering except under high vacuum, and existing solutions like ultrasonic soldering or swaging a sleeve on the coax waveguide result in mechanically weak or time-consuming joints with undesirable electrical reflections.
Innovation Solution
Electroplating a solderable metal layer, such as copper (Cu) or nickel (Ni), onto the Nb/Ti substrate using a mechanical polishing and sanding process, followed by electroplating in a metal sulfamate bath, allowing for strong adhesion and direct soldering of connectors without high vacuum or swaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If Nb/Ti is heated for soldering, then soldering can be performed, but a tough oxide layer forms that prevents normal soldering
Solution Approach 1:
The patent applies preliminary action by depositing a solderable metal layer (such as copper or nickel) onto the Nb/Ti substrate before the soldering process. This pre-deposited layer serves as an intermediary that enables soldering to proceed at lower temperatures without forming problematic oxide layers on the Nb/Ti itself. The metal layer is applied in advance through electroplating or other deposition techniques, creating a surface that is inherently more solderable.
Solution Approach 2:
The patent uses an intermediary approach by introducing a metal layer between the Nb/Ti substrate and the solder joint. This intermediate layer acts as a mediator that facilitates the soldering process, allowing solder to bond effectively without directly contacting the Nb/Ti surface. The intermediary layer prevents harmful oxide formation on the Nb/Ti while still enabling strong mechanical and electrical connections.
2Productivity
If ultrasonic soldering or swaging is used, then connectors can be joined to Nb/Ti, but mechanical strength is weak or joints are time-consuming
Solution Approach 1:
The patent replaces mechanical joining methods (such as swaging or ultrasonic soldering) with a metallurgical bonding approach. Instead of using mechanical force or vibration to create joints, the patent employs electroplating to deposit a metal layer that creates strong metallurgical bonds with both the Nb/Ti substrate and the connector. This substitution of mechanical systems with electrochemical deposition and subsequent soldering results in stronger, more reliable joints.
Solution Approach 2:
The patent applies parameter changes by modifying the surface properties of the Nb/Ti substrate through electroplating. By changing the surface composition and structure through metal deposition, the patent enables soldering parameters (temperature, time, force) to be optimized for stronger joints. The electroplating process alters surface characteristics such as roughness, composition, and reactivity, which in turn enables improved soldering outcomes with better mechanical strength and faster production.
3Reliability
If Nb/Ti is used for coaxial cables, then microwave properties are excellent, but soldering requires high vacuum conditions
Solution Approach 1:
The patent applies preliminary action by pre-coating the Nb/Ti cable surface with a solderable metal layer before the cable assembly process. This pre-deposited layer eliminates the need for complex high-vacuum soldering environments, as the soldering can proceed under normal atmospheric conditions. The preliminary metal deposition simplifies the overall device complexity while preserving the excellent microwave properties of the Nb/Ti cable.
Solution Approach 2:
The patent introduces an intermediary metal layer that mediates between the Nb/Ti cable and the connector. This intermediate layer enables soldering to occur without requiring high-vacuum conditions, thereby reducing device complexity. The intermediary layer maintains the electrical and microwave performance of the Nb/Ti while providing a surface that is easily solderable under conventional conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient soldering of metal connectors to Nb/Ti cables at low temperatures with excellent mechanical strength and microwave properties, suitable for ultra-low-temperature applications like qubit circuits, with no signal reflections and constant impedance.
Implementation Method 1
electroplating a solderable metal layer, such as copper (Cu) or nickel (Ni), onto the Nb/Ti substrate using a mechanical polishing and sanding process, followed by electroplating in a metal sulfamate bath
Data Source
AI summary
A structure, such as a cable assembly, is provided that has a Nb/Ti substrate and a metal layer electroplated on a portion of the Nb/Ti substrate, wherein the metal layer has a metal capable of being soldered to, such as copper, and a metal coaxial connector soldered to the metal layer.