NCF Recess Structure in Semiconductor Packages for Bond Reliability
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Solution Overview
Problem
The performance and reliability of multi-chip semiconductor packages are adversely affected by the physical and chemical characteristics of the adhesive layer, leading to potential failures.
Innovation Solution
Incorporating non-conductive films (NCFs) between the substrate and semiconductor chips, which define recess regions overlapping with scribe lanes and extending onto active regions, to enhance the semiconductor package structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an adhesive layer is used between chips in a multi-chip package, then the chips can be bonded together, but the physical and chemical characteristics of the adhesive layer may cause performance degradation and reliability issues
Solution Approach 1:
The patent removes the adhesive layer from the multi-chip package structure, replacing it with a mechanical interlocking system. The recess regions in the substrate and corresponding protrusions on the chip bottom surfaces eliminate the need for adhesive materials, thereby avoiding the reliability issues associated with adhesive layer characteristics while maintaining bonding strength through physical engagement.
Solution Approach 2:
The patent introduces recess regions as an intermediary structural feature between the substrate and chips. These recess regions serve as a mechanical mediator that enables direct physical contact and interlocking between components, replacing the chemical bonding function previously performed by adhesive layers and eliminating the harmful effects of adhesive material degradation.
2Reliability
If non-conductive films are added between substrate and chips, then package integrity and reliability are improved, but device complexity increases
Solution Approach 1:
The non-conductive films serve multiple functions simultaneously: they provide electrical insulation between conductive elements, act as a structural support layer, and facilitate the formation of recess regions for mechanical interlocking. This multi-functionality allows the package to achieve improved reliability without proportionally increasing complexity, as a single component performs multiple critical roles.
Solution Approach 2:
The patent utilizes thin non-conductive film layers to achieve multiple protective and structural functions. These thin films provide necessary insulation and structural integrity without adding significant bulk or complexity to the package design, allowing for miniaturization while maintaining reliability improvements.
Data Source
AI summary
A semiconductor package includes a semiconductor chip on a substrate. The semiconductor chip includes an active region, and a scribe lane in continuity with an edge of the active region. A non-conductive film (NCF) is between the substrate and the semiconductor chip, the non-conductive film (NCF) at least partially defines a recess region overlapping with the scribe lane in plan view and extending on the active region.