Near-chip Compliant Layer for Perimeter Stress Reduction
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Solution Overview
Problem
High-performance electronic computing systems face challenges in managing global force inequalities when multiple misaligned semiconductor chips are contacted with a common heat sink, leading to excessive mechanical stress on the perimeter of heat-generating components.
Innovation Solution
A near-chip compliant layer made of compressible material is introduced to absorb global force inequalities, reducing the maximal local force applied to the heat source by distributing the force more evenly across the perimeter.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a common heat sink is used to contact multiple misaligned semiconductor chips, then thermal management is improved, but excessive mechanical stress is applied to the perimeter of the heat-generating components
Solution Approach 1:
A compliant layer is introduced as an intermediary element between the heat sink and the semiconductor chips. This layer absorbs misalignment and distributes mechanical stress, preventing excessive perimeter stress while maintaining thermal contact. The compliant layer acts as a mediator that decouples the rigid heat sink from the potentially misaligned chips.
Solution Approach 2:
The patent changes the mechanical compliance parameter of the interface between heat sink and chips by introducing a compliant layer with specific material properties. This layer has controlled elasticity and compliance characteristics that allow it to accommodate misalignment and distribute forces evenly, transforming the rigid interface into a compliant one.
2Force
If a mechanically compliant TIM1 is used to reduce local force inequalities, then force distribution is improved, but thermal performance deteriorates
Solution Approach 1:
The patent segments the thermal management system into distinct functional layers: a compliant layer for mechanical stress absorption and a thermal interface material (TIM1) for heat transfer. This segmentation allows each layer to optimize its specific function without compromising the other, enabling both good force distribution and thermal performance.
Solution Approach 2:
The compliant layer serves as a mechanical intermediary that protects the chips from stress while allowing effective thermal contact. It mediates between the rigid heat sink structure and the fragile semiconductor chips, enabling the use of stiffer TIM1 materials that provide better thermal conductivity without causing mechanical damage.
3Temperature
If a stiffer or thinner TIM1 is used to improve thermal performance, then heat transfer is improved, but mechanical stress on the die increases
Solution Approach 1:
The system is segmented into a compliant layer for mechanical protection and a stiffer TIM1 for thermal conduction. This allows the TIM1 to be optimized for thermal performance with higher stiffness and lower thickness, while the compliant layer beneath it absorbs mechanical stresses that would otherwise damage the die.
Solution Approach 2:
The compliant layer acts as a protective intermediary between the rigid structures (heat sink and substrate) and the fragile semiconductor die. It allows the use of stiffer TIM1 materials by absorbing the mechanical compliance requirement, enabling thinner and more thermally conductive TIM1 without increasing die stress.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The compliant layer effectively reduces excess mechanical stress on the perimeter of heat-generating components during thermal sink attachment, protecting them from damage and ensuring even force transfer, thereby improving thermal performance and reducing the risk of component damage.
Implementation Method 1
a support member including a compressible material... such that the support member including the compressible material at least partially absorbs global inequality of force
Data Source
AI summary
A heat source (single semiconductor chip or group of closely spaced semiconductor chips of similar height) is provided on a first side of a substrate, which substrate has on said first side a support member comprising a compressible material. A heat removal component, oriented at an angle to said heat source, is brought into proximity of said heat source such that said heat removal component contacts said support member prior to contacting said heat source. Said heat removal component is assembled to said heat source such that said support member at least partially absorbs global inequality of force that would otherwise be applied to said heat source, absent said support member comprising said compressible material.