Near-Memory Interface Circuit for Low-Latency Data Operations

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Solution Overview

Problem

Computer systems experience significant data latency and memory access inefficiencies, particularly in memory-intensive applications like artificial intelligence and big data, due to the long 'round trip' latency of fetching data from main memory.

Innovation Solution

A memory interface circuit with an instruction decoder and execution unit is introduced to execute memory-related instructions near the memory, reducing the distance and latency of data access by performing operations such as logic functions and comparisons independently.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If data is fetched from main memory by the CPU, then data storage capacity is sufficient, but data latency is significant due to long round trip time

Engineering Contradiction:
Improvedata storage capacityVSAvoiddata latency
Core Design Contradiction:
Quantity of substanceVSLoss of time

Solution Approach 1:

The system segments memory access operations by introducing multiple cache levels (L1, L2, L3) between main memory and the CPU. Each cache level stores frequently accessed data closer to the CPU, dividing the single long memory access path into multiple shorter access paths. This segmentation reduces the average data latency while maintaining sufficient storage capacity across the hierarchical structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Cache memory acts as an intermediary between the CPU and main memory. The cache stores copies of frequently used data from main memory, allowing the CPU to access this data quickly without repeatedly accessing the slower main memory. This intermediary structure reduces the round trip latency for frequently accessed data while maintaining access to the full capacity of main memory when needed.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Speed

If cache memory is used to speed data retrieval, then data access speed is improved, but physical distance from CPU increases for L2 and L3 caches

Engineering Contradiction:
Improvedata access speedVSAvoidphysical distance from CPU
Core Design Contradiction:
SpeedVSLength of stationary object

Solution Approach 1:

The cache system is segmented into multiple levels with different characteristics. L1 cache is positioned closest to the CPU for fastest access, while L2 and L3 caches are positioned progressively farther away but provide larger storage capacity. This segmentation allows the system to optimize for both speed (L1) and capacity (L3) while managing the physical distance trade-off across the hierarchy.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different cache levels have different local qualities optimized for their specific functions. L1 cache is small and very fast for critical frequently accessed data, L2 cache provides medium capacity and speed for less frequently accessed data, and L3 cache provides large capacity for bulk storage. Each level's physical placement and size are optimized for its specific role in the memory hierarchy.

Inventive Principle:
Principle #3Local quality

3Adaptability or versatility

If multiple cache levels are implemented, then storage capacity and access flexibility are improved, but access time increases for L2 and L3 caches

Engineering Contradiction:
Improveaccess flexibilityVSAvoidaccess time
Core Design Contradiction:
Adaptability or versatilityVSLoss of time

Solution Approach 1:

Data is pre-loaded into the cache hierarchy before it is needed by the CPU. When the CPU accesses data, the system checks the cache levels in order (L1, then L2, then L3), and if the data is found in any cache level, it is returned immediately without needing to access main memory. This preliminary positioning of data in the cache hierarchy reduces the average access time while maintaining adaptability for different access patterns.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS12591429B2Memory interface
Publication Date: 2026.03.31 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US12591429B2 patent drawing
  • US12591429B2 patent drawing
  • US12591429B2 patent drawing

AI summary

A memory interface circuit includes an instruction decoder configured to receive an instruction from a processor to generate a corresponding control code. An execution circuit is configured to receive the control code from the instruction decoder and access a memory and generate an arithmetic result according to the control code.