Needle Alignment Verification Circuit for Semiconductor Testing
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Solution Overview
Problem
The limited number of channels in semiconductor testers increases overall test time due to the need for dedicated channels to verify needle alignment with semiconductor device pads, reducing efficiency.
Innovation Solution
A needle alignment verification circuit that uses the ground voltage as a probe signal, eliminating the need for a separate channel by integrating the verification process within the existing voltage channel, utilizing a sensor pad with insulation and conductive parts and transmission lines to detect misalignment through logic state changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a dedicated channel is assigned to verify needle alignment, then alignment verification can be performed, but the number of available channels for other uses decreases and overall test time increases
Solution Approach 1:
The patent makes existing voltage channels perform dual functions: both providing power voltage to the semiconductor device and verifying needle alignment. By integrating alignment verification into the voltage channel's existing functionality, the system eliminates the need for dedicated alignment verification channels, thereby reducing total test time while maintaining reliable alignment verification
Solution Approach 2:
The patent merges the needle alignment verification function with the voltage channel's power supply function. The sensor pad, when contacted by a needle, detects the voltage state to determine alignment status, combining two separate operations into one unified process that occurs simultaneously during normal voltage application
2Reliability
If a dedicated channel is assigned to verify needle alignment, then alignment verification can be performed, but the number of available channels for other uses decreases
Solution Approach 1:
The voltage channels are designed to serve multiple purposes simultaneously: providing power voltage to operational circuits and performing needle alignment verification through sensor pads. This multi-functionality increases channel versatility and availability while ensuring reliable alignment verification is performed
Data Source
AI summary
A needle alignment verification circuit includes a sensor pad, a first transmission line, a control element, a data pad, a second transmission line, and a response element. The sensor pad includes an insulation part and a conduction part. The first transmission line is electrically connected to the conduction part and to the interior of the semiconductor device. The control element asserts the first transmission line at a first logic state, and upon receiving the probe signal at the conduction part, transitions the logic state of the first transmission line to a second logic state. The second transmission line provides a predetermined signal to the data pad. The response element controls the second transmission line so that the second transmission line has the state of a verification result voltage for a misalignment state in response to the second logic state.