Negative Fillet Mounting for Integrated Device Die
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Solution Overview
Problem
Existing methods for mounting integrated device dies to carriers often result in mounting compounds extending beyond the lateral side edges, which can interfere with adjacent components and occupy excessive space, posing challenges in close-proximity arrangements.
Innovation Solution
The integration of a recessed surface on the integrated device die with a mounting compound that includes a first portion between the die and the carrier and a second portion along a recessed surface, ensuring the compound does not contact the outer side edge, thereby preventing interference with adjacent components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If mounting compound is applied between the die and carrier, then the die is securely mounted to the carrier, but the compound extends past the lateral side edges of the die which interferes with adjacent components
Solution Approach 1:
The patent divides the mounting compound into distinct regions: a first portion positioned between the die and carrier for secure mounting, and a second portion positioned within a recessed region that does not extend beyond the die's lateral side edges. This segmentation prevents the compound from interfering with adjacent components while maintaining secure mounting through the first portion.
Solution Approach 2:
The patent creates a recessed region with different geometric properties (deeper than the compound height) at specific locations on the die. This local modification ensures that the mounting compound is contained within the recessed region and does not extend beyond the lateral side edges, thereby eliminating interference with adjacent components while preserving mounting functionality.
2Strength
If mounting compound is applied to ensure secure attachment, then the die is firmly fixed to the carrier, but excessive space is occupied and close-proximity arrangements become difficult
Solution Approach 1:
The mounting compound is segmented into a first portion for attachment and a second portion contained within the recessed region. This segmentation allows the compound to provide secure attachment strength through the first portion while the second portion is confined to not extend beyond the die's lateral edges, thus reducing the overall space occupied and enabling close-proximity arrangements.
Solution Approach 2:
The patent utilizes the vertical dimension by creating a recessed region that extends deeper than the mounting compound height. This dimensional approach allows the compound to be contained within the recessed region without extending laterally beyond the die's side edges, thereby maintaining attachment strength while reducing the horizontal space occupied.
Data Source
AI summary
In some embodiments, an electronic module is disclosed. The electronic module can include a carrier and an integrated device die having an upper surface, a lower surface, and an outer side edge. The integrated device die can include a first surface recessed from the lower surface and a second surface extending between the lower surface and the first surface. The second surface can be laterally inset from the outer side edge. The electronic module can include a mounting compound comprising a first portion disposed between the lower surface of the integrated device die and the carrier and a second portion disposed along at least a portion of the second surface of the integrated device die.