Negative Photosensitive Resin Composition for Cu Interface Void Suppression
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Solution Overview
Problem
Conventional photosensitive resin compositions used in semiconductor devices face issues with void generation at the interface of the Cu layer and resin layer during high-temperature storage evaluation, and require high chemical resistance and resolution to meet miniaturization demands, especially in flip-chip mounting and fan-out semiconductor packages.
Innovation Solution
A negative photosensitive resin composition comprising a polyimide precursor, a compound with urethane or urea bonds, and a photopolymerization initiator, which suppresses void formation and enhances chemical resistance and resolution, allowing for the formation of a cured relief pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional photosensitive resin composition is used, then the resin layer can be formed, but voids are generated at the interface of the Cu layer and resin layer during high-temperature storage evaluation
Solution Approach 1:
The patent changes the chemical composition parameters of the resin layer by incorporating specific compounds (carboxylic acid compounds, hydroxyl group-containing compounds, amino group-containing compounds) that interact with the Cu layer to prevent void formation during high-temperature storage
Solution Approach 2:
The patent introduces intermediary compounds (carboxylic acid compounds, hydroxyl group-containing compounds, amino group-containing compounds) that act as mediators between the Cu layer and the resin matrix, improving interfacial adhesion and preventing void formation
2Volume of moving object
If miniaturization is pursued in flip-chip mounting and fan-out semiconductor packages, then device size is reduced, but chemical resistance and resolution requirements increase
Solution Approach 1:
The patent creates a composite resin composition combining multiple functional components (polymer base, carboxylic acid compounds, hydroxyl group-containing compounds, amino group-containing compounds) to achieve both miniaturization compatibility and enhanced chemical resistance
Solution Approach 2:
The patent applies different functional compounds at specific locations and interfaces (particularly at the Cu layer interface) to provide localized chemical resistance and resolution enhancement where needed most in miniaturized devices
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high chemical resistance and resolution, preventing voids at the Cu layer interface and ensuring suitable adhesion with mold resin, particularly in fan-out semiconductor packages.
Implementation Method 1
a photopolymerization initiator
Data Source
AI summary
Provided are a negative photosensitive resin composition and a method for forming a cured relief pattern using the same with which a high chemical resistance and resolution can be obtained and in which the occurrence of voids in the interface of a Cu layer contacting a resin layer after high-temperature storage evaluation can be suppressed. Provided is a negative photosensitive resin composition including (A) a polyimide precursor represented by general formula (1) below; (B) a compound having at least one selected from a urethane bond and a urea bond; and (C) a photopolymerization initiator. In the formula, X1, Y1, n1, R1, and R2 are each as defined in the description of the present application.