Negative Photosensitive Resin Composition for Low-Temperature Curing
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Solution Overview
Problem
Current negative photosensitive resin compositions struggle to achieve high resolution and excellent mechanical characteristics such as rupture elongation and tensile strength, especially when cured at low temperatures, while maintaining heat resistance and adhesiveness to substrates.
Innovation Solution
A negative photosensitive resin composition comprising an alkali-soluble resin, a polymer compound with cyclopolymerization structural units, a light-generated acid compound, and a heat crosslinking agent, which allows for fine pattern formation and high resolution, along with enhanced mechanical properties and heat resistance when cured at low temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a closed-ring polyimide resin is used to lower post-curing temperature, then the curing temperature is reduced, but the mechanical characteristics (elongation and tensile strength) and adhesion of the cured film deteriorate
Solution Approach 1:
The patent uses a composite resin system combining polyimide resin (for heat resistance and low curing temperature) with (meth)acrylic resin (for mechanical strength and adhesion). This composite approach allows the cured film to achieve both low curing temperature and excellent mechanical characteristics, resolving the contradiction between temperature reduction and strength maintenance.
2Strength
If (meth)acrylic resin is added to improve mechanical strength, then the mechanical characteristics of the cured film are enhanced, but the resolution of fine patterns deteriorates
Solution Approach 1:
The patent optimizes the molecular weight, functional group content, and composition ratio of the (meth)acrylic resin to balance mechanical strength and lithography resolution. By carefully controlling these parameters, the resin achieves adequate mechanical properties while maintaining the ability to form fine patterns with high resolution.
3Strength
If resins with cyclic structures (cyclopolymerization monomer units) are used to improve mechanical strength, then the elastic recovery and breaking strength are enhanced, but the photosensitive characteristics for radical crosslinking show room for improvement
Solution Approach 1:
The patent combines resins with cyclopolymerization monomer units (for mechanical strength) with photopolymerization-initiated radical crosslinking systems (for photosensitive characteristics). This merging of two different crosslinking mechanisms ensures both excellent mechanical properties and reliable photosensitive performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables the formation of films with excellent mechanical strength, heat resistance, and adhesiveness, suitable for use as interlayer insulation and surface protective films in semiconductor devices, ensuring reliable performance under various environmental conditions.
Implementation Method 1
a photopolymerization initiator
Implementation Method 2
a heat crosslinking agent
Data Source
AI summary
A negative photosensitive resin composition including: an alkali-soluble resin containing at least one structure selected from a polyimide structure, a polyamide structure, a polybenzoxazole structure, a polyamide-imide structure, and a precursor structure thereof, a polymer compound having a structural unit formed by cyclopolymerization, a compound that generates an acid by light, and a heat crosslinking agent.