Negative Photosensitive Resin Composition for Sub-2 μm Semiconductor Patterns
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Solution Overview
Problem
Existing negative photosensitive resin compositions fail to achieve sufficiently high resolution and insulation reliability for advanced semiconductor integration, limiting the formation of highly integrated circuits.
Innovation Solution
A negative photosensitive resin composition combining a polyhydroxyamide compound, an oxime sulfonate compound, and a crosslinking agent, specifically designed to have a weight average molecular weight of 2,000 to 20,000, without carboxyl groups, and containing methoxymethyl and methylol groups, is used to enhance resolution and insulation reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional negative photosensitive resin compositions are used, then the process is simple and ease of manufacture is maintained, but resolution and insulation reliability are insufficient for highly integrated circuits
Solution Approach 1:
The patent employs a composite resin composition combining polyhydroxyamide compound (A), oxime sulfonate compound (B), and crosslinking agent (C) with specific structural requirements. This composite approach achieves resolution of 5 μm or less and aspect ratio of 2.0 or more while maintaining insulation reliability, resolving the contradiction between manufacturing precision and device complexity by optimizing the synergistic interaction of multiple components.
Solution Approach 2:
The patent specifies precise parameter ranges: weight average molecular weight of polyhydroxyamide compound (A) is 2,000 to 20,000, carboxyl group equivalent is 1,500 g/eq or more, and contains methoxymethyl groups and/or methylol groups in crosslinking agent (C). These controlled parameter changes enable the resin composition to achieve both high resolution (5 μm or less) and high aspect ratio (2.0 or more) while maintaining insulation reliability.
2Manufacturing precision
If higher resolution is achieved, then fine patterning is improved, but insulation reliability may deteriorate
Solution Approach 1:
The composite resin system combines polyhydroxyamide compound (A) with oxime sulfonate compound (B) and crosslinking agent (C) to simultaneously achieve high resolution (5 μm or less) and high aspect ratio (2.0 or more) while maintaining insulation reliability. The specific structural requirements of each component work synergistically to resolve the contradiction between resolution and insulation reliability.
Solution Approach 2:
By controlling the weight average molecular weight of polyhydroxyamide compound (A) within 2,000 to 20,000 and ensuring carboxyl group equivalent of 1,500 g/eq or more, the patent achieves both high resolution (5 μm or less) and high aspect ratio (2.0 or more) while maintaining insulation reliability, thus resolving the contradiction between manufacturing precision and reliability.
3Reliability
If polyimide precursor is used, then insulating properties and heat resistance are excellent, but resolution is insufficient for high integration
Solution Approach 1:
The patent uses a composite resin composition where polyhydroxyamide compound (A) serves as the base resin providing insulating properties and heat resistance, combined with oxime sulfonate compound (B) and crosslinking agent (C). This composite approach achieves resolution of 5 μm or less and aspect ratio of 2.0 or more while maintaining excellent insulating properties and heat resistance, resolving the contradiction between reliability and manufacturing precision.
Solution Approach 2:
The patent specifies that polyhydroxyamide compound (A) has weight average molecular weight of 2,000 to 20,000 and carboxyl group equivalent of 1,500 g/eq or more. These controlled parameter changes enable the resin to achieve both high resolution (5 μm or less) and high aspect ratio (2.0 or more) while maintaining excellent insulating properties and heat resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves fine patterning with line/space less than 2 μm/2 μm, aspect ratios of 2.0 or more, and improved insulation reliability, suitable for forming fine wiring in semiconductor circuits.
Implementation Method 1
a compound that generates an acid by irradiation with an actinic ray
Implementation Method 2
a compound that can be crosslinked or polymerized by an action of an acid
Data Source
AI summary
Provided is a new negative photosensitive resin composition having better resolution and insulation reliability. The negative photosensitive resin composition contains: an (A) polyhydroxyamide compound containing a structural unit represented by the following formula (1); a (B) oxime sulfonate compound; and a (C) crosslinking agent, wherein the (A) polyhydroxyamide compound has a weight average molecular weight of 2,000 to 20,000, the (A) polyhydroxyamide compound does not contain a carboxyl group or has a carboxyl group equivalent of 1,500 g/eq or more, and the (C) crosslinking agent contains a plurality of methoxymethyl groups and/or methylol groups.(In the formula, R1 represents a divalent organic group, and R2 represents a tetravalent organic group.)