Negative Pressure Holder Plate for Uniform Wafer De-Bonding
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Solution Overview
Problem
Existing wafer thinning processes face challenges with insufficient stress strength and a high risk of breakage due to non-uniform force application during the stripping of carrier plates.
Innovation Solution
A holder plate for negative pressure chucking is designed with a plate body having a holding surface and a bottom surface, featuring air passages that communicate between the surfaces and form ventilation openings. The holder plate is made of materials with high thermal conductivity (>100 W/mK) and has a specific distribution of ventilation openings to ensure uniform negative pressure application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional fixing methods are used to hold the wafer on the holder plate, then the wafer can be fixed during processing, but the force application is non-uniform causing warpage and breakage during carrier plate stripping
Solution Approach 1:
The holder plate is segmented into multiple ventilation openings distributed across its surface, each creating localized negative pressure zones. This segmentation allows uniform force distribution across the entire wafer surface, preventing warpage and breakage during carrier plate stripping while maintaining reliable wafer fixation.
Solution Approach 2:
The invention uses negative pressure (vacuum) applied through ventilation openings in the holder plate to uniformly hold the wafer. This pneumatic approach replaces conventional mechanical fixing methods that concentrate force at specific points, thereby preventing wafer warpage and breakage while maintaining secure fixation during processing.
2Productivity
If the holder plate has high thermal conductivity to enable rapid heating for adhesive softening, then the stripping process efficiency improves, but the material selection and manufacturing complexity increase
Solution Approach 1:
The holder plate is designed with high thermal conductivity (>100 W/mK) to enable rapid heating and efficient adhesive softening during the stripping process. This parameter change in thermal conductivity directly improves productivity by reducing heating time and enhancing heat transfer efficiency, despite the increased material selection constraints.
3Stability of the object's composition
If the ventilation openings occupy a large area to improve negative pressure distribution, then uniform force application improves, but the structural integrity and thermal performance of the holder plate deteriorate
Solution Approach 1:
The ventilation openings are strategically distributed across the holder plate surface with their total area controlled within specific ranges (0.1-50% of holder plate area). This local quality approach ensures sufficient negative pressure distribution for uniform force application while maintaining the overall structural integrity and thermal performance of the holder plate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables uniform negative pressure distribution on thin sheet products, effectively preventing warpage and breakage during the wafer stripping process, thereby enhancing the reliability of the wafer thinning process.
Implementation Method 1
a uniformly distributed negative pressure can be applied to the thin sheet product
Implementation Method 2
The thermal conductivity of the holder plate is greater than 100 W/mK
Data Source
AI summary
A holder plate for negative pressure chucking, in which the holder plate is plate body comprising a holding surface and a bottom surface. Air passages are formed inside the holder plate and communicates the holding surface and the bottom surface, and the air passages form a plurality of ventilation openings on the holding surface. A total area of an opening of the ventilation openings in the holding surface is less than 50% of the area of the holder plate and greater than 0.2% of the area of the holder plate. The thermal conductivity of the holder plate is greater than 100 W/mK; wherein W is watts, m is meters, and K is the absolute temperature scale.