Negative Photosensitive Resin Composition for Semiconductor Lithography
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Solution Overview
Problem
Conventional negative photosensitive resin compositions used in photolithography for semiconductor and organic light emitting diode (OLED) manufacturing face challenges such as poor stripping properties with substrates and poor tolerance to evaporation processes, leading to issues like deformation and poor pattern quality.
Innovation Solution
A negative photosensitive resin composition comprising an alkali-soluble resin blend of acrylate and novolac resins, a photoacid generator, a basic compound, and a cross-linking agent, specifically formulated with monomers that enhance heat resistance and solubility, such as those with tricyclodecane or dicyclopentadiene structures and xylenol compounds, to improve the stripping properties and tolerance to evaporation processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional negative photosensitive resin composition is used to form a photoresist pattern, then the pattern can be formed, but the stripping property with the substrate is poor
Solution Approach 1:
The patent uses a composite resin system comprising both novolac resin and acrylate resin. The novolac resin provides good adhesion to the substrate during processing, while the acrylate resin enables effective stripping after use. This composite approach resolves the contradiction by combining materials with complementary properties, allowing the photoresist pattern to be formed reliably and then removed effectively without damaging the substrate.
2Reliability
If the photoresist pattern is subjected to high-temperature deaeration treatment, then water and solvent can be removed, but the rib is deformed
Solution Approach 1:
The patent modifies the chemical composition parameters of the photoresist material by incorporating novolac resin with specific molecular structure and acrylate resin with controlled crosslinking density. These parameter changes enable the material to withstand high-temperature deaeration treatment (up to 150°C or higher) without deformation, while still achieving effective water and solvent removal. The controlled crosslinking provides thermal stability without excessive rigidity that would cause deformation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively addresses the challenges of poor stripping properties and evaporation tolerance, resulting in photoresist patterns that are easily removable and resistant to damage during high-temperature processes, thereby enhancing the manufacturing efficiency and quality of semiconductor and OLED devices.
Implementation Method 1
a photoacid generator (B)
Data Source
AI summary
A negative photosensitive resin composition including an alkali-soluble resin (A), a photoacid generator (B), a basic compound (C), a cross-linking agent (D), and a solvent (E) is provided. The alkali-soluble resin (A) includes an acrylate resin (A-1) and a novolac resin (A-2). The acrylate resin (A-1) is synthesized by polymerizing a monomer for polymerization, wherein the monomer for polymerization includes an unsaturated carboxylic acid or unsaturated carboxylic acid anhydride monomer (a-1-1) and a monomer (a-1-2). The monomer (a-1-2) includes a compound (a-1-2-1) with a tricyclodecane or dicyclopentadiene structure, a compound (a-1-2-2) represented by formula (1), or a combination of both. The novolac resin (A-2) is synthesized by polymerizing an aldehyde compound with an aromatic hydroxy compound, wherein the aromatic hydroxy compound includes a xylenol compound.