Negative Photosensitive Resin Composition for High Resolution and Heat Resistance
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Solution Overview
Problem
Conventional negative-type photosensitive resin compositions face challenges in achieving high sensitivity, resolution, and heat resistance, with existing materials either having low film properties due to high sensitivity or low sensitivity due to high molecular weight, and crosslinking efficiency being insufficient in chemical amplification systems.
Innovation Solution
A negative-type photosensitive resin composition comprising a polymer with a phenolic hydroxyl group, an acid generator, and a compound capable of crosslinking or polymerizing with the acid, specifically using polyimide, polyoxazole, polyamideimide, polyamide, polyamic acid, or polyhydroxyamide, which are soluble in alkali aqueous solutions, along with a compound having methylol or alkoxyalkyl groups, to enhance sensitivity, resolution, and heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional negative-type photosensitive resin compositions use high molecular weight polymers to achieve heat resistance, then heat resistance is improved, but sensitivity and resolution deteriorate
Solution Approach 1:
The patent changes the molecular weight parameter of the polymer from high (conventional) to low (10,000-100,000), which improves sensitivity and resolution while maintaining heat resistance through the specific chemical structure containing phenolic hydroxyl groups at terminal positions
Solution Approach 2:
The patent creates a composite system by combining the low molecular weight polymer with specific additives including acid generators and crosslinking agents, achieving both high sensitivity and heat resistance that neither component could achieve alone
2Productivity
If conventional negative-type photosensitive resin compositions use low molecular weight polymers to improve sensitivity, then sensitivity is improved, but film properties and heat resistance deteriorate
Solution Approach 1:
The patent optimizes the molecular weight to a specific range (10,000-100,000) that balances sensitivity and film properties, and introduces specific chemical structure parameters (phenolic hydroxyl groups at terminal positions) that enhance both sensitivity and film quality
Solution Approach 2:
The patent introduces crosslinking agents as intermediaries that form crosslinked structures during curing, which enhance film properties and heat resistance without affecting the low molecular weight structure that provides high sensitivity
3Productivity
If chemical amplification systems are used to enhance sensitivity, then sensitivity is improved, but crosslinking efficiency and resolution deteriorate
Solution Approach 1:
The patent extracts and eliminates the chemical amplification system from the photosensitive resin composition, using instead a direct photoacid generator system that provides high sensitivity without the resolution degradation and crosslinking efficiency problems associated with chemical amplification
Solution Approach 2:
The patent replaces the complex chemical amplification mechanism with a simpler direct photolysis mechanism using photoacid generators, achieving high sensitivity through direct acid generation without the multi-step chemical amplification process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent sensitivity, resolution, and heat resistance, with a good cured film property even at low thermal curing temperatures, and results in highly reliable electronic parts as surface protection or interlayer insulation films.
Implementation Method 1
a compound which generates an acid by irradiation of active light
Implementation Method 2
a compound which can be crosslinked or polymerized by an action of the acid
Data Source
AI summary
A negative-type photosensitive resin composition which is good in sensitivity and resolution, a pattern forming method by the use thereof wherein a pattern which can be developed in an alkali aqueous solution, is excellent in sensitivity, resolution and heat resistance and has a good shape is obtained, and highly reliable electronic parts are provided. The negative-type photosensitive rein composition includes (a) a polymer that has a phenolic hydroxyl group at a terminal and is soluble in the alkali aqueous solution, (b) a compound that generates an acid by irradiating active light, and (c) a compound that can be crosslinked or polymerized by an action of the acid.