Negative Patterned Substrate for Stable Semiconductor Molding
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Solution Overview
Problem
In semiconductor packaging, the non-uniform pressure applied during molding can cause molding resin to overflow onto heat release metal layers, leading to substrate contamination and instability, necessitating improved thermal conductivity and heat radiation efficiency.
Innovation Solution
A semiconductor package with a negative patterned substrate featuring a metal material, insulating layers, metal pattern layers, semiconductor chips, electrical connecting members, and a molding sealing member, where the substrate is designed to prevent resin overflow and includes radiation fins and a cooling system for enhanced thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If uniform pressure is applied during molding, then substrate contamination is prevented, but device complexity increases
Solution Approach 1:
The negative patterned substrate is prepared in advance with recessed regions that will contain the molding resin. This preliminary structuring of the substrate allows the molding process to proceed with simpler pressure application, as the resin containment is already built into the substrate geometry rather than requiring complex real-time pressure control during molding.
Solution Approach 2:
The negative patterned substrate acts as an intermediary structure between the molding resin and the heat release metal layers. The recessed regions of the substrate serve as containment chambers that mediate the interaction between the resin and the substrate surface, preventing direct contact and contamination while simplifying the molding process.
2Temperature
If radiation fins are added to expand contact areas, then heat radiation efficiency is improved, but device complexity increases
Solution Approach 1:
The radiation fins are merged with the negative patterned substrate as an integrated structure. The fins are formed as part of the substrate manufacturing process, combining the thermal management function with the structural substrate, thereby improving heat radiation efficiency without significantly increasing overall device complexity.
Solution Approach 2:
Radiation fins are added to the substrate, extending the heat dissipation surface into a third dimension. This dimensional expansion increases the contact area for thermal management while maintaining compatibility with the existing substrate structure and manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents substrate contamination and stabilizes the molding process while enhancing thermal conductivity and heat radiation efficiency by ensuring uniform pressure and efficient coolant contact.
Implementation Method 1
a molding resin may not flow to the outside of the negative patterned substrate so as to prevent the substrate from being contaminated
Implementation Method 2
there is a need for an improvement in thermal conductivity and heat radiation efficiency using a direct cooling method by a coolant
Implementation Method 3
direct cooling method by a coolant
Data Source
AI summary
The present invention relates to a semiconductor package having a negative patterned substrate and a method of manufacturing the same, and more particularly, to a semiconductor package having a negative patterned substrate and a method of manufacturing the same, wherein in the semiconductor package and the method of manufacturing the same, a molding resin may not flow to the outside of the negative patterned substrate so as to prevent the substrate from being contaminated and a negative space is filled with the molding resin so as to stably perform a molding process.