Negative Tone Resist Composition for High Resolution Patterning
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Solution Overview
Problem
Current negative tone development processes for forming resist patterns with chemically amplified resist compositions using organic solvents face challenges in achieving high resolution and reducing surface roughness, which affects the quality of fine semiconductor elements.
Innovation Solution
A resist composition with a base component containing an acrylate ester-derived structural unit having an acid decomposable group and an —SO2— containing cyclic group is used, which exhibits decreased solubility in organic solvents, allowing for selective exposure and development to form fine resist patterns with improved lithography properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If negative tone development is performed using organic solvent-based developing solutions, then the process can form resist patterns, but the resolution and surface roughness quality deteriorate
Solution Approach 1:
The patent changes the chemical parameters of the resist composition by incorporating specific compounds: a carboxylic acid component ( Exhibits increased solubility in alkali developing solutions under the action of acid), sulfonic acid component ( Exhibits increased solubility in alkali developing solutions under the action of acid), and phosphonic acid component ( Exhibits increased solubility in alkali developing solutions under the action of acid). These parameter changes enable the resist to achieve both high resolution and low surface roughness by controlling the dissolution behavior during development.
Solution Approach 2:
The patent uses a composite resist composition containing multiple functional components working together: the carboxylic acid component, sulfonic acid component, phosphonic acid component, and base resin. This composite material approach allows the resist to exhibit both high resolution (due to controlled acid diffusion) and low surface roughness (due to uniform dissolution characteristics) that cannot be achieved with single-component systems.
2Manufacturing precision
If chemically amplified resist compositions are used to achieve high resolution, then sensitivity and resolution improve, but surface roughness and pattern uniformity worsen
Solution Approach 1:
The patent introduces acid scavenger components as intermediaries that regulate the acid-catalyzed dissolution process. These scavengers control the rate and uniformity of dissolution by modulating acid concentration during development, thereby reducing surface roughness and pattern defects while preserving the high resolution achieved through chemically amplified resist mechanisms.
Solution Approach 2:
The patent modifies the dissolution parameters by adding components with specific solubility characteristics in organic developing solutions. The carboxylic acid, sulfonic acid, and phosphonic acid components are selected to exhibit controlled solubility changes, enabling high-resolution patterning while minimizing surface roughness through optimized dissolution kinetics.
3Ease of manufacture
If conventional resist materials are used for fine patterning, then the process is simple, but the ability to form high-resolution patterns with minimal roughness deteriorates
Solution Approach 1:
The patent creates a multi-functional resist composition that simultaneously provides: (1) high resolution through chemically amplified resist mechanisms, (2) low surface roughness through controlled dissolution, (3) good adhesion through base resin selection, and (4) compatibility with standard organic developing solutions. This universal composition maintains process simplicity while achieving superior fine patterning results.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed method enables the formation of resist patterns with enhanced resolution and reduced surface roughness, addressing defects such as non-uniform line widths and distortions, thereby improving the quality of fine semiconductor elements.
Implementation Method 1
an acid-generator component (B) which generates acid upon exposure
Implementation Method 2
a base component (A) which exhibits decreased solubility in an organic solvent under action of an acid
Data Source
AI summary
A method of forming a resist pattern, including: forming a resist film on a substrate using a resist composition containing a base component (A) which exhibits decreased solubility in an organic solvent under action of an acid and an acid-generator component (B) which generates an acid upon exposure, conducting exposure of the resist film, and patterning the resist film by a negative tone development using a developing solution containing an organic solvent, wherein the base component (A) includes a resin component (A1) containing a structural unit (a1) derived from an acrylate ester containing an acid decomposable group which exhibits increased hydrophilicity by the action of an acid and a structural unit (a0) derived from an acrylate ester containing an —SO2— containing cyclic group.