Nematic Liquid Crystal Polymer Substrate for 3D Wearable Molding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional flexible printed circuit boards (FPCBs) are not suitable for three-dimensional shapes, particularly for wearable devices that require stretchability and natural deformation, limiting their application in next-generation wearable technology.
Innovation Solution
A substrate with an insulating layer having a nematic structure and specific surface roughness, combined with a circuit pattern and protective layer, is manufactured using a carrier frame with directional grain, allowing for easy separation and thermoforming into complex three-dimensional shapes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional polyimide-based flexible printed circuit board is simply bent and three-dimensionally connected, then manufacturing process is simple, but it cannot achieve stretchability and natural deformation required for wearable devices
Solution Approach 1:
The patent uses a composite structure consisting of a flexible substrate with a nematic liquid crystal polymer layer combined with a crystalline polymer layer. This composite material structure provides both stretchability for wearable devices and structural stability, resolving the contradiction between adaptability and complexity by integrating multiple material functions into a unified composite system.
Solution Approach 2:
The patent changes the physical and chemical parameters of the substrate material by introducing a nematic liquid crystal polymer with specific molecular orientation. This parameter change enables the material to exhibit stretchability and natural deformation properties while maintaining structural integrity, allowing conventional simple bending processes to achieve advanced wearable device requirements.
2Stability of the object's composition
If rigid-flex type is used combining rigid multi-layer printed circuit board and flexible connection circuit, then structural stability is improved, but natural deformation and three-dimensional shape transformation are limited
Solution Approach 1:
The patent replaces the static rigid-flex structure with a dynamic flexible substrate that can naturally deform and transform into three-dimensional shapes. The nematic liquid crystal polymer layer provides dynamic molecular reorientation capability, allowing the substrate to adapt to complex three-dimensional configurations while maintaining structural stability through its unique molecular structure.
Solution Approach 2:
The patent employs a thin film flexible substrate with nematic liquid crystal polymer that can conform to complex three-dimensional surfaces. This flexible thin film structure eliminates the need for rigid components while maintaining structural stability, enabling natural deformation and seamless integration with wearable device surfaces.
3Ease of manufacture
If substrate is manufactured without directional grain structure, then manufacturing process is simple, but separation difficulty and residual stress increase
Solution Approach 1:
The patent introduces an asymmetric directional grain structure in the flexible substrate through uniaxial stretching during manufacturing. This asymmetric grain orientation creates preferred separation planes that facilitate easy substrate separation while reducing residual stress. The directional grain structure provides a systematic approach to manufacturing that balances simplicity with improved separability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the production of substrates that can be easily separated and molded into complex three-dimensional shapes, reducing manufacturing complexity and costs, and is suitable for mass production of 3D molding, while minimizing residual stress.
Implementation Method 1
the insulating layer includes a polymer having a nematic structure
Implementation Method 2
an insulating layer having a grain formed therein extending in a first direction
Data Source
AI summary
A substrate according to an embodiment includes an insulating layer having a grain formed therein extending in a first direction; and a circuit pattern disposed on the insulating layer; wherein the insulating layer includes an upper surface and a plurality of outer side surfaces; wherein the plurality of outer side surfaces includes: a first outer side surface extending in the same first direction as the first direction having the grain formed in the insulating layer; and a second outer side surface extending in a second direction different from the first direction and excluding the first outer side surface, wherein the first outer side surface has a first surface roughness; and wherein the second outer side surface has a second surface roughness different from the first surface roughness.