Nested Bath Pressure Control for Uniform Substrate Etching
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in adjusting the boiling point of chemical solutions, maintaining concentration consistency, and performing uniform etching processes regardless of external pressure variations.
Innovation Solution
A substrate processing apparatus with an outer bath and inner bath configuration, including gas and chemical solution supply pipes, allows for controlling the pressure of the outer receiving space to adjust the boiling point and maintain chemical solution concentration, using inert gases to enhance etching uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If gas is supplied into the outer receiving space to control pressure, then the boiling point of chemical solution can be adjusted, but the device complexity increases due to additional gas supply pipes and pressure control mechanisms
Solution Approach 1:
The patent implements a nested bath configuration where the inner bath is positioned inside the outer bath. The outer receiving space between the outer bath and inner bath serves as a pressure control chamber. This nesting structure allows the gas supply system to control the boiling point of the chemical solution in the inner bath by adjusting pressure in the outer receiving space, without requiring separate external pressure control equipment.
Solution Approach 2:
The outer receiving space acts as an intermediary medium between the gas supply system and the chemical solution. Gas supplied into the outer receiving space mediates the pressure control function, which in turn adjusts the boiling point of the chemical solution in the inner bath. This intermediary approach allows indirect but effective control of the chemical solution's thermal properties.
2Manufacturing precision
If pressure control is implemented to maintain chemical solution concentration, then etching uniformity improves, but the ease of operation decreases due to additional control parameters
Solution Approach 1:
The nested bath structure integrates pressure control and chemical solution containment functions. The outer bath with its receiving space provides a built-in pressure control mechanism that directly affects the inner bath's chemical solution. This integration eliminates the need for separate external pressure control systems, making the apparatus more self-contained and potentially easier to operate despite the added functionality.
Solution Approach 2:
The outer receiving space serves multiple functions: it acts as a pressure control chamber, provides thermal insulation, and maintains chemical solution concentration. By combining these functions into a single structural element, the patent reduces the number of separate control systems needed, thereby improving ease of operation while maintaining etching uniformity.
3Stability of the object's composition
If outer bath and inner bath configuration is used to control pressure independently, then process uniformity across different pressures is achieved, but the volume of chemical solution required increases
Solution Approach 1:
The inner bath is nested within the outer bath, creating a compact configuration where the outer receiving space provides pressure control volume without requiring a large external container. This nested arrangement allows independent pressure control while minimizing the total volume of chemical solution needed compared to using a single large bath.
Solution Approach 2:
The bath system is segmented into an outer bath and an inner bath, with the outer receiving space dedicated to pressure control and the inner bath containing the chemical solution. This segmentation allows the pressure control function to operate independently with a small volume of gas in the outer space, while the inner bath contains only the necessary volume of chemical solution for the process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves improved etching yield and uniform processing by controlling the boiling point and concentration of chemical solutions, enabling the use of various concentrations and maintaining process consistency across different pressures.
Implementation Method 1
supplying a gas into the outer receiving space... adjusting a boiling point of a chemical solution
Implementation Method 2
The chemical solution may etch the substrate at a high-temperature
Data Source
AI summary
A substrate processing apparatus includes an outer bath, an inner bath in the outer bath, a chemical solution supply pipe in fluid communication with a portion of the outer bath, and an outer gas supply pipe in fluid communication with another portion of the outer bath. The outer bath includes an outer body providing an outer receiving space, and an outer door coupled to the outer body and configured to close the outer receiving space. An end of the outer gas supply pipe is located in the outer receiving space between the outer body and the inner bath, and a portion of the chemical solution supply pipe is located in the inner bath.