Nested Co-Blindmate Optical Switch Connectors
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Solution Overview
Problem
High-density optical communication systems face challenges in accommodating increasing data demands with limited optical fiber interconnects, leading to complex cabling and deployment issues, and require efficient cooling solutions for high-power density components.
Innovation Solution
The nested co-blindmate high-density optical switch system integrates liquid, optical, and electrical connectors in an electro-optical-mechanical design, enabling scalable optical fabric topologies, efficient cooling, and compact packaging with modular assemblies for high-performance systems, leveraging optical switches and liquid cooling to address thermal density and connectivity needs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If more optical fibers are added to accommodate increasing data demand, then the data handling capacity is improved, but the system complexity and cabling complexity increase
Solution Approach 1:
The patent implements nested connector configurations where connectors are arranged in nested relationships, allowing multiple optical fiber connections to be achieved through hierarchical nesting of connector assemblies. This reduces the number of separate cabling paths needed while maintaining high data handling capacity.
Solution Approach 2:
The patent creates universal connector assemblies that can accommodate multiple types of connections (optical, electrical, liquid cooling) through a single integrated interface. This multi-functional connector design reduces overall system complexity by consolidating what would otherwise require separate cabling systems.
2Quantity of substance
If high-density optical fiber interconnects are implemented, then data handling capacity is improved, but deployment difficulty and installation complexity increase
Solution Approach 1:
The patent incorporates pre-configured connector assemblies with integrated alignment features and pre-attached optical fibers. These preliminary preparations allow for rapid deployment without requiring complex field installations, as the connectors are designed to be pre-assembled and pre-tested before system integration.
Solution Approach 2:
The nested connector design allows connectors to be inserted into one another in a hierarchical manner, simplifying the deployment process. This nesting approach enables incremental system building where connectors can be added or removed in organized sequences, making high-density configurations more manageable during installation.
3Quantity of substance
If high-power density components are used to increase data throughput, then data handling capacity is improved, but cooling requirements and thermal management complexity increase
Solution Approach 1:
The patent merges the cooling connection interface with the optical and electrical connector interfaces into a single integrated assembly. By combining liquid cooling ports with the optical fiber and electrical connection points, the system achieves high data throughput while managing thermal loads through integrated cooling pathways that follow the same physical routes as data and power connections.
Solution Approach 2:
The universal connector assembly serves multiple functions simultaneously: optical data transmission, electrical power and signal delivery, and liquid cooling flow. This multi-functional design allows high-power density components to be cooled efficiently through the same interface structure used for data and power connections, reducing thermal management complexity.
4Device complexity
If integrated electro-optical-mechanical connector assemblies are used, then system compactness and connection reliability are improved, but manufacturing complexity increases
Solution Approach 1:
The patent segments the integrated connector assembly into modular sub-components that can be manufactured separately and then assembled. This segmentation allows each subsystem (optical, electrical, cooling) to be produced using specialized manufacturing processes, then combined into the final integrated assembly, reducing overall manufacturing complexity while maintaining system compactness.
Solution Approach 2:
The nested configuration of connectors within the assembly allows for compact packaging of multiple connection types in a small volume. The hierarchical nesting of optical, electrical, and cooling connectors creates a space-efficient design that achieves high integration without requiring complex manufacturing tooling, as the nested structure naturally organizes components in a compact arrangement.
Data Source
AI summary
Systems and methods are provided for a nested co-blindmate high-density optical switch system. The nested co-blindmate high-density optical switch system can include a system enclosure, and an enclosure midplane that is installed the system enclosure. Further, a switch chassis can be enclosed by the system enclosure, and liquid blindmate to a liquid line on a rack; optically blindmate to at least one blade in the system enclosure; and electrically blindmate to the enclosure midplane. At least one optical switch line-card can be included in the system, which is enclosed by the switch chassis, and further enclosed by the system enclosure in a nested manner. The at least one optical switch line-cards can liquid blindmate to the switch chassis, optically blindmate to the switch chassis, and electrically blindmate to the enclosure midplane.