Nested Coaxial Conductor Structures for Heat Dissipation and Noise Reduction
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Solution Overview
Problem
Current interconnection circuitry in semiconductor devices faces challenges in miniaturization and heat dissipation, particularly due to the complexity and manufacturing difficulties of forming large-dimension conductors like elongated structures, which are needed for improved conduction and noise reduction.
Innovation Solution
The development of solid elongated conductor structures within substrates, formed through specific manufacturing processes such as laser drilling and electroless copper plating, which provide enhanced conduction and signal isolation by creating coaxial conductors with larger dimensions than traditional through-silicon vias, facilitating better heat dissipation and noise protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional through-silicon via conductors are used, then manufacturing is simpler, but conduction performance and noise reduction are insufficient
Solution Approach 1:
The patent implements nested coaxial conductor structures where an inner conductor is positioned within an outer conductor, both extending through the substrate. This nested configuration enhances conduction performance and provides electromagnetic shielding while maintaining a compact structure that can be integrated into existing substrate architectures.
Solution Approach 2:
The patent transitions from traditional single-conductor through-silicon vias to multi-dimensional coaxial conductor structures. The addition of outer conductors surrounding inner conductors creates a three-dimensional conductor configuration that improves conduction performance and noise reduction without significantly increasing manufacturing complexity.
2Temperature
If larger-dimension conductors are formed, then heat dissipation improves, but manufacturing difficulty increases
Solution Approach 1:
The patent divides the conductor structure into segmented components including inner conductors, outer conductors, and dielectric material layers. This segmentation allows for controlled formation of each component through sequential manufacturing steps, making the overall larger-dimension conductor structure manufacturable while achieving improved heat dissipation.
Solution Approach 2:
The patent utilizes parameter changes in the manufacturing process, including controlled deposition thicknesses, laser drilling parameters, and sintering conditions, to form conductors with optimized dimensions for heat dissipation. By precisely controlling these parameters, the patent achieves larger-dimension conductors that improve thermal management without making the manufacturing process prohibitively difficult.
3Object-affected harmful factors
If coaxial conductor structures are implemented, then noise reduction improves, but device complexity increases
Solution Approach 1:
The nested coaxial conductor configuration provides inherent electromagnetic shielding where the outer conductor surrounds the inner conductor, creating a Faraday cage effect that reduces noise and interference. This structural arrangement achieves noise reduction through geometric configuration rather than additional complex materials or processes.
Solution Approach 2:
The coaxial conductor structure serves multiple functions simultaneously: it provides electrical conduction, electromagnetic shielding for noise reduction, and thermal management. By integrating these functions into a single conductor configuration, the patent reduces noise without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These elongated conductor structures enable improved heat dissipation and reduced noise in semiconductor devices, supporting the miniaturization and performance enhancement of electronic components while overcoming manufacturing challenges.
Implementation Method 1
an elongated slot through a thickness of a substrate... formed through specific manufacturing processes such as laser drilling
Implementation Method 2
electroless copper plating, which provide enhanced conduction
Data Source
AI summary
Embodiments of substrates, semiconductor devices and methods are shown that include elongated structures to improve conduction. Elongated structures and methods are also shown that provide electromagnetic isolation to reduce noise in adjacent components.