Nested Conical Heat Sink for Circuit Device Thermal Management

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Solution Overview

Problem

Conventional heat sinks for electronic devices often struggle to effectively manage thermal buildup due to limitations in thermal resistance pathways and airflow configurations, which can lead to inefficient heat dissipation across various components within computing devices.

Innovation Solution

A heat sink design featuring a base member with nested conical shells, where each shell has an inclined internal surface and orifices to facilitate both direct and cross-flow mixing of air, enhancing convective heat transfer by creating a turbulent flow pattern that improves thermal management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional heat sinks use multiple thin plates joined to a base with parallel airflow, then the structure is simple and easy to manufacture, but the convective heat transfer efficiency is insufficient due to limited airflow mixing

Engineering Contradiction:
Improvestructural simplicityVSAvoidheat dissipation efficiency
Core Design Contradiction:
Ease of manufactureVSTemperature

Solution Approach 1:

The patent employs nested conical shells where smaller shells are positioned inside larger shells, creating multiple flow paths within a compact structure. This nesting arrangement allows air to flow through multiple shells simultaneously, increasing the effective heat transfer surface area and promoting turbulent mixing without significantly increasing overall device complexity

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent uses conical shells with curved surfaces instead of flat plates. The inclined internal surfaces of the conical shells redirect airflow at angles, creating cross-flow patterns and turbulent mixing that enhance convective heat transfer efficiency compared to conventional parallel plate designs

Inventive Principle:
Principle #14Spheroidality (Curvature)

2Ease of operation

If conventional heat sinks use direct parallel airflow through thin plates, then the airflow path is simple, but the thermal resistance pathway is insufficient for effective heat dissipation

Engineering Contradiction:
Improveairflow configuration simplicityVSAvoidthermal resistance pathway
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The heat sink is divided into multiple discrete conical shells, each with its own flow path through orifices in the base. This segmentation creates multiple parallel thermal pathways, reducing overall thermal resistance by distributing heat flow across numerous independent channels rather than relying on a single plate structure

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from two-dimensional parallel plate flow to three-dimensional conical shell flow paths. The inclined surfaces and orifice configurations create vertical and radial flow components, adding dimensional complexity to the airflow pattern and enhancing heat transfer through multi-directional convection

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design significantly enhances convective heat transfer by promoting direct and cross-flow mixing, leading to more efficient heat dissipation from electronic devices, thereby addressing the limitations of traditional heat sink configurations.

Implementation Method 1

a base member adapted to establish thermal contact with a circuit device

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The fluid is moved through the first shell and the at least one additional shell

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

enhancing convective heat transfer by creating a turbulent flow pattern

Methodology Applied
Scientific EffectTurbulence: Turbulence

Data Source

PatentUS7911791B2Heat sink for a circuit device
Publication Date: 2011.03.22 ATI TECHNOLOGIES ULC
  • US7911791B2 patent drawing
  • US7911791B2 patent drawing
  • US7911791B2 patent drawing

AI summary

Various heat sinks, method of use and manufacture thereof are disclosed. In one aspect, a method of providing thermal management for a circuit device is provided. The method includes placing a heat sink in thermal contact with the circuit device wherein the heat sink includes a base member in thermal contact with the circuit device, a first shell coupled to the base member that includes a first inclined internal surface, a lower end and first plurality of orifices at the lower end to enable a fluid to transit the first shell, and at least one additional shell coupled to the base member and nested within the first shell. The at least one additional shell includes a second inclined internal surface and a second plurality of orifices to enable the fluid to transit the at least one additional shell. The fluid is moved through the first shell and the at least one additional shell.