Nested Control Electronics in Solid State Circuit Breakers
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Solution Overview
Problem
Conventional solid state circuit breakers are costly and incur higher conduction losses during non-fault conditions, necessitating a need for reduced device cost and power losses.
Innovation Solution
The design incorporates a solid state circuit breaker with strategically positioned control electronics relative to a heat sink, utilizing multiple heat sinks and thermal management techniques such as thermal grease, to minimize volume and enhance heat dissipation, while maintaining efficient current regulation and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional solid state circuit breakers are used, then fault protection capability is provided, but device cost and conduction losses are higher than traditional electromechanical circuit breakers
Solution Approach 1:
The control electronics are nested within the heat sink structure, with the control PCB positioned between heat sink fins. This integration allows the heat sink to serve dual purposes: thermal management and structural housing for control electronics, thereby reducing overall device volume and component count while maintaining fault protection capability
Solution Approach 2:
The patent merges the heat sink and control electronics housing into a single integrated structure. The control electronics are positioned within the heat sink fins, combining thermal management and control functions into one component, which reduces device cost and improves thermal efficiency
2Volume of stationary object
If control electronics are positioned away from heat sink, then thermal management is simpler, but device volume increases and heat dissipation efficiency decreases
Solution Approach 1:
The control electronics are nested within the heat sink fins, allowing the heat sink to provide both thermal management and structural enclosure. This eliminates the need for separate housing and reduces overall device volume while enhancing heat dissipation through direct thermal coupling
Solution Approach 2:
The heat sink fins are designed with varying characteristics: outer fins provide thermal management, while inner fins provide structural support and housing for control electronics. This localized differentiation optimizes both heat dissipation and device compactness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the physical dimensions and power losses of the solid state circuit breaker, achieving cost-effectiveness and improved performance by optimizing heat sink placement and thermal management.
Implementation Method 1
a heat sink positioned in thermal contact with the power electronics module such that heat generated from the power electronics module is dissipated through the heat sink
Implementation Method 2
utilizing multiple heat sinks and thermal management techniques such as thermal grease, to minimize volume and enhance heat dissipation
Data Source
AI summary
A solid state switching device, such as a solid state circuit breaker, includes at least one heat sink, a control electronics printed circuit board (PCB), and power electronics. The power electronics are useful to regulate the flow of current from one terminal of the solid state switching device to another terminal. The power electronics can include one or more solid state devices such as FETs, Thyristors, Thyristors+SiC JFET in parallel, IGBTs, and IGCTs. The control PCB can include a variety of circuit elements useful to perform the function of a gate driver useful to activate the solid state device of the power electronics. The heat sink includes one or more signal vias formed therethrough to permit nesting of the control PCB within the heat sink.