Nested Harness Circuit Board Layout for Low-Height Connectivity
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Solution Overview
Problem
The existing circuit board structures in harness assemblies have a significant increase in height due to their design, which can lead to space constraints and inefficiencies.
Innovation Solution
A harness assembly design featuring a main circuit board with an accommodating portion that houses a supplemental circuit board, along with conductive and inner conductors, and connection portions to ensure compactness and electrical connectivity, while using resilient and shielding properties to prevent interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a circuit board structure with an interposer is used to connect the device with the circuit board, then electrical connectivity is achieved, but the height of the assembly increases
Solution Approach 1:
The supplemental circuit board is nested within the main circuit board by placing it in the accommodating portion formed in the main circuit board. This nesting arrangement allows the supplemental circuit board to be housed inside the main circuit board's structure, thereby reducing the overall height of the assembly while maintaining electrical connectivity through the conductive portions that electrically connect the supplemental circuit board to the main circuit board
Solution Approach 2:
Instead of stacking components vertically which increases height, the invention utilizes the planar dimension by forming an accommodating portion within the main circuit board's footprint. The supplemental circuit board is positioned in this accommodating portion, effectively using the available horizontal space rather than extending vertically, thus reducing the Z-direction height while maintaining connectivity through conductive traces on the circuit board planes
2Adaptability or versatility
If multiple circuit boards are stacked to achieve functionality, then electrical connectivity and functionality are improved, but the device complexity and height increase
Solution Approach 1:
The invention merges the main circuit board and supplemental circuit board into a single integrated circuit board structure. The supplemental circuit board is positioned within the main circuit board's accommodating portion, and both are electrically connected through conductive portions formed on the main circuit board. This merging approach achieves the functionality of multiple circuit boards while presenting a unified, less complex external structure
Solution Approach 2:
The main circuit board is designed with multi-functionality by incorporating both the main circuit board's own circuitry and the supplemental circuit board's circuitry within its structure. The accommodating portion and conductive portions enable the main circuit board to serve dual purposes: as the primary circuit board and as a housing and connection interface for the supplemental circuit board, thereby reducing the need for separate independent circuit board structures
Data Source
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AI summary
An assembly comprises a circuit board structure and a plurality of connection portions. The circuit board structure has a main circuit board and a supplemental circuit board. The main circuit board is formed with an accommodating portion. The accommodating portion is recessed downward in an up-down direction from an upper surface of the main circuit board. The main circuit board has a plurality of upper main conductive portions which are formed on the upper surface of the main circuit board. The supplemental circuit board has a plurality of upper supplemental conductive portions which are formed on an upper surface of the supplemental circuit board. The supplemental circuit board is, at least in part, accommodated in the accommodating portion. Each of ones of the connection portions connects a respective one of the upper main conductive portions and a respective one of the upper supplemental conductive portions with each other.