Nested Header Fluid Cooler for Electronic Components
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Solution Overview
Problem
As electronic components become smaller and are packed in arrays, traditional heat dissipation methods like heat fins are inadequate, and there is a need for an efficient cooling fluid supply system to manage increased heat generation and distribute cooling fluid effectively across multiple components.
Innovation Solution
A fluid cooler packet with multiple individual cooling circuits that receive cooling fluid from a supply header and return it to a return header, where the volume of the supply header decreases and the return header increases downstream, ensuring efficient fluid distribution and pressure regulation through a nested header structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional heat fins are used for heat dissipation, then the structure is simple, but the heat dissipation efficiency is inadequate for small electronic components
Solution Approach 1:
The cooling system is divided into multiple individual cooling circuits, each serving specific electronic components. The supply header is segmented into multiple supply passages and the return header into multiple return passages, allowing independent cooling zones that can be optimized for different heat loads and component arrangements.
Solution Approach 2:
The supply header and return header are nested within each other in a concentric arrangement, with supply passages and return passages interleaved. This nested structure allows both headers to occupy the same lateral space, significantly reducing the overall cooling system footprint while maintaining efficient fluid distribution to multiple components.
2Quantity of substance
If electronic components are packed in plural arrays, then the component density increases, but the cooling fluid distribution becomes more difficult
Solution Approach 1:
The cooling system uses multiple individual cooling circuits with separate supply and return passages for each circuit, allowing precise fluid distribution to densely packed components. Each circuit can be independently configured to match the specific arrangement and cooling requirements of components in the array.
Solution Approach 2:
The nested header structure with interleaved supply and return passages enables compact fluid distribution networks that can reach densely packed components without requiring large lateral spacing. The concentric arrangement allows efficient routing of cooling fluid to multiple components within a small area.
3Temperature
If the cooling system is designed with multiple individual cooling circuits, then the cooling efficiency improves, but the header volume and system height increase
Solution Approach 1:
The supply header and return header are arranged in a nested concentric configuration, where the return header is positioned within the lateral footprint of the supply header. This nesting allows both headers to share the same space, dramatically reducing the overall cooling system volume and height while maintaining multiple individual cooling circuits for efficient heat removal.
Solution Approach 2:
The cooling system transitions from a planar two-dimensional layout to a three-dimensional concentric arrangement. By utilizing vertical stacking and radial positioning of supply and return passages, the system achieves compact volume while maintaining adequate flow paths for multiple cooling circuits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages heat dissipation across small electronic components by ensuring efficient cooling fluid distribution and pressure regulation, maintaining performance while reducing the overall height of the cooling system.
Implementation Method 1
heat transfer mechanisms, and more particularly, to cooling apparatuses , cooled electronic modules and methods of fabrication thereof for removing heat generated by one or more electronic devices
Data Source
Figure 1
Figure 2A
Figure 2B~2E
AI summary
A fluid cooler packet (141) for a plurality of electronic components has a plurality of individual cooling circuits for receiving a supply of cooling fluid from a supply header (S) and delivering that cooling fluid to an associated electronic component (22). The plurality of cooling circuits each includes a return passage for receiving a return fluid after having cooled the associated electronic component, and returns the return fluid to a return header (R). A volume of the supply header (S) decreases in a downstream direction as it passes over the plurality of individual cooling circuits. A volume of the return header (R) increases as it moves in a downstream direction over the plurality of individual cooling circuits.