Nested Heat Dissipating Structure for Compact Electronic Devices

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Solution Overview

Problem

As electronic devices become smaller, they are more prone to overheating due to inadequate heat dissipation, necessitating an efficient and space-conscious heat management solution.

Innovation Solution

A heat-dissipating structure comprising a metal substrate with a heat dissipating element and a graphite layer, where the heat dissipating element is fixed using a metal plate and can directly or indirectly contact critical components like the CPU and battery, allowing for effective heat dissipation without increasing the device's thickness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the device size is reduced, then the portability is improved, but the heat dissipation capability deteriorates

Engineering Contradiction:

Improvedevice sizeVSAvoidheat dissipation capability

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The heat dissipation cavity is nested within the substrate structure, utilizing the internal space of the substrate to house the heat dissipation cavity. This allows the heat dissipation components to be integrated within the existing device volume without increasing the overall device size, thus resolving the contradiction between compact form factor and heat dissipation capability.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The heat dissipation solution transitions from two-dimensional surface mounting to three-dimensional volumetric utilization by creating a cavity within the substrate. This vertical integration into the substrate thickness dimension enables effective heat dissipation pathways without expanding the device's footprint area.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Temperature

If a heat dissipation structure is added, then the heat dissipation capability is improved, but the device thickness increases

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoiddevice thickness

Core Design Contradiction:

TemperatureVSLength of stationary object

Solution Approach 1:

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The heat dissipation structure is merged with the substrate by forming the heat dissipation cavity directly within the substrate material. The substrate serves dual functions as both a structural support and a heat dissipation pathway, eliminating the need for separate thick heat sinks and reducing overall device thickness.

Inventive Principle:

Principle #5Merging (Combining)

3Temperature

If the heat dissipation cavity is formed in the substrate, then the heat dissipation efficiency is improved, but the structural strength of the substrate deteriorates

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidsubstrate structural strength

Core Design Contradiction:

TemperatureVSStrength

Solution Approach 1:

The substrate is constructed using composite material structure where reinforcing elements are integrated within the substrate matrix. This composite construction allows the formation of heat dissipation cavities while maintaining adequate structural strength through the distributed reinforcement architecture.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The substrate exhibits non-uniform structural properties with reinforced regions strategically positioned to maintain strength while other regions are optimized for heat dissipation. The local quality variation allows cavity formation in specific areas without compromising the overall structural integrity of the substrate.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables efficient heat dissipation along a thermal gradient, maintaining structural integrity and minimizing space usage, effectively addressing the overheating issue in compact electronic devices.

Implementation Method 1

enables efficient heat dissipation along a thermal gradient

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

A heat-dissipating structure comprising a metal substrate with a heat dissipating element and a graphite layer

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10437299B2Heat-dissipating structure of electronic device

Publication Date: 2019.10.08 CHIUN MAI COMM SYST INC

AI summary

An electronic device includes a first housing portion, a second housing portion, a circuit board, a battery, a display screen, and a heat-dissipating structure. The second housing portion is coupled together with the first housing portion. The circuit board and the battery are received within the second housing portion. The heat-dissipating structure is arranged between the circuit board and the display screen. The heat-dissipating structure includes a substrate including a first surface and a second surface opposite to the first surface and defines an opening passing through the first surface and the second surface. The heat dissipating element is located in the opening.