Nested Heat Pipe Assembly for Slim Device Thermal Management
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Solution Overview
Problem
Slim and compact portable electronic devices face challenges in heat dissipation due to limited internal space, as traditional air cooling devices are not feasible, and existing heat pipe configurations may not efficiently transfer heat from the heat source to the display casing.
Innovation Solution
A heat dissipation assembly featuring a first heat pipe with a unique insertion hole configuration, where the central line of the hole is at different distances from the outer peripheral wall along different directions, allowing for a flat shape and effective vapor channel volume, enabling efficient heat transfer between heat pipes, and a second heat pipe that is pivotably inserted for thermal contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional air cooling devices are used, then heat dissipation effectiveness is improved, but device thickness and internal space requirements increase
Solution Approach 1:
The patent implements nested heat pipes where the second heat pipe is partially inserted into the first heat pipe, creating a space-efficient configuration. This nesting arrangement allows multiple heat dissipation pathways within a compact volume, effectively solving the contradiction between heat dissipation effectiveness and device thickness by utilizing three-dimensional space optimization.
Solution Approach 2:
The patent transitions from traditional planar heat dissipation to a three-dimensional nested structure. By arranging heat pipes in multiple layers and orientations (including the pivotable connection allowing angular adjustment), the system achieves enhanced heat dissipation effectiveness without increasing the device's external dimensions, thereby resolving the thickness contradiction.
2Temperature
If heat pipe configurations are optimized for heat transfer efficiency, then heat dissipation performance is improved, but structural complexity increases
Solution Approach 1:
The heat dissipation system is divided into multiple independent heat pipe segments (first heat pipe and second heat pipe) that can be separately optimized and assembled. Each heat pipe can be independently configured with its own vapor channel and insertion hole, allowing for modular optimization of heat transfer efficiency without proportionally increasing overall structural complexity.
Solution Approach 2:
The insertion hole in the first heat pipe is positioned asymmetrically with its central line at different distances from the outer peripheral wall along different directions. This asymmetric configuration optimizes the thermal contact area and vapor channel efficiency while maintaining a relatively simple overall structure, resolving the contradiction between heat transfer efficiency and structural complexity.
3Temperature
If heat pipe insertion depth is increased for better thermal contact, then heat transfer efficiency is improved, but available space and assembly flexibility are reduced
Solution Approach 1:
The second heat pipe is connected to the first heat pipe through a pivotable connection, allowing the insertion depth and angle to be dynamically adjusted. This dynamic configuration enables optimization of thermal contact area for heat transfer efficiency while maintaining assembly flexibility to adapt to different device layouts and space constraints, effectively resolving the contradiction between insertion depth and adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for effective heat dissipation in slim devices by maintaining a flat profile while ensuring sufficient vapor channel volume for efficient heat transfer, ensuring the heat source is effectively cooled and preventing internal temperature increases.
Implementation Method 1
use heat pipes as an efficient heat transfer component for heat dissipation. Specifically, there are two heat pipes partially sleeved with each other and thermally respectively connected to a heat source and a display casing so that the heat generated from the heat source can be transferred to the display casing and dissipated to the environment
Implementation Method 2
A vapor channel is formed between the outer peripheral wall and the inner peripheral wall
Implementation Method 3
The metal casing and the heat source are in thermal contact with each other via the first heat pipe and the second heat pipe
Data Source
AI summary
A heat dissipation assembly and portable electronic device including the same wherein heat dissipation assembly includes first heat pipe. The first heat pipe includes first end part and second end part that are opposite to each other. The second end part includes inner peripheral wall and outer peripheral wall surrounding the inner peripheral wall. A vapor channel is formed between the outer peripheral wall and the inner peripheral wall. The inner peripheral wall forms insertion hole. A central line of the insertion hole is at first distance from the outer peripheral wall along first direction. The central line of the insertion hole is at second distance from the outer peripheral wall along second direction. The first direction is different from the second direction, and the first distance is different from the second distance.