Nested Interconnect Structure for High Density IC Packaging
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Solution Overview
Problem
As integrated circuits become more complex, the increasing number of interconnect levels required for electrical connections between devices poses challenges in achieving a small form factor, low cost, and high electrical performance, particularly in mobile applications where packaging technologies need to support a tight power budget and high connectivity.
Innovation Solution
A nested interconnect structure in a concentric arrangement is introduced, comprising an inner core pad and an outer ring pad on back-end-of-line layers with a redistribution layer and under bump metallization to support package balls, leveraging wafer level packaging technology for improved bump density and network flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of interconnect levels is increased to support more devices, then connectivity is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent implements a nested interconnect structure where an inner core pad is surrounded by an outer ring pad in a concentric arrangement. This nesting allows multiple interconnect functions to be integrated within a single structural footprint, effectively increasing connectivity without proportionally increasing the number of separate interconnect levels or structures.
Solution Approach 2:
The patent transitions from traditional planar interconnect arrangements to a three-dimensional concentric configuration. By utilizing radial and axial dimensions in the interconnect structure, the design achieves higher connectivity density without linearly increasing the number of interconnect levels, thereby managing complexity while enhancing adaptability.
2Reliability
If more interconnect levels are used to increase connectivity, then electrical performance improves, but manufacturing process intricacy increases
Solution Approach 1:
The patent combines multiple interconnect functions into a unified nested structure consisting of an inner core pad and an outer ring pad. This merging reduces the number of discrete manufacturing steps required compared to implementing separate interconnect levels, thereby improving ease of manufacture while maintaining high electrical performance through the integrated concentric design.
3Area of stationary object
If package size is reduced to achieve small form factor, then space efficiency improves, but interconnect density requirements increase
Solution Approach 1:
The nested concentric arrangement of the inner core pad and outer ring pad allows the interconnect structure to maintain high functional density within a reduced footprint. This nesting enables multiple interconnect pathways to coexist in a compact configuration, achieving both small package size and high interconnect density simultaneously.
Data Source
AI summary
An integrated circuit (IC) package is described. The IC package includes back-end-of-line layers on a substrate. The IC package also includes a nested interconnect structure on the back-end-of-line layers on the substrate. The nested interconnect structure is composed of an inner core pad and an outer ring pad in a concentric arrangement. The IC package further includes a redistribution layer on the nested interconnect structure. The IC package also includes an under bump metallization layer on the redistribution layer to support package balls.