Nested Inter-Substrate Interconnects for Dense EMI-Shielded Packaging

The patent implements nested interconnect structures where inner interconnects are positioned within outer interconnects, allowing multiple signal paths to occupy the same spatial footprint. This nesting arrangement reduces the overall package volume while maintaining complex interconnect functionality, directly resolving the contradiction between compact size and structural complexity.

The patent transitions from planar interconnect arrangements to three-dimensional stacked configurations with inner and outer interconnect layers at different heights. By utilizing the vertical dimension, the design achieves higher interconnect density without increasing the lateral package footprint, thereby reducing package size while managing complexity through structured layering.

The patent introduces dielectric layers as intermediary materials between inner and outer interconnects. These dielectric layers act as electromagnetic shields and isolation barriers, preventing cross-talk and interference between adjacent signal paths while allowing high-density interconnect routing. This mediator approach enables increased electrical path density without proportionally increasing harmful electromagnetic effects.

The patent strategically positions outer interconnects to serve dual functions: as signal carriers and as electromagnetic shields for inner interconnects. By converting the potential harmful effect of closely spaced interconnects into a beneficial shielding arrangement, the design achieves high interconnect density while naturally suppressing cross-talk and electromagnetic interference through the geometric configuration itself.