Nested Interposer Packaging With Bump-Pad Self-Alignment
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Solution Overview
Problem
Current multi-die packaging architectures face challenges with larger form factors and poor yield and reliability due to alignment issues and warpage when using traditional packaging substrates, particularly with interconnections between dies.
Innovation Solution
The use of heterogeneous nested interposers with cavities and nested components, where dies are connected to the interposer and nested components using interconnects that include bump pads for self-alignment, improving alignment and reliability even with fine-pitched interconnects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional packaging substrates are used for multi-die integration, then dies can be connected together, but alignment precision deteriorates due to warpage and larger form factors
Solution Approach 1:
The packaging substrate is divided into multiple interposer layers (first interposer layer, second interposer layer) with cavities and nested components. This segmentation allows each layer to be independently optimized for alignment precision while reducing overall warpage and form factor complexity through distributed structural design.
Solution Approach 2:
Components are nested within cavities in the interposer layers, creating a compact hierarchical structure. This nesting approach reduces the lateral form factor while maintaining precise alignment through the vertical stacking architecture, directly addressing the contradiction between precision and complexity.
2Productivity
If traditional packaging substrates are used, then multi-die integration is achieved, but yield and reliability worsen due to alignment issues and warpage
Solution Approach 1:
The substrate is segmented into multiple thin interposer layers rather than one thick substrate. This reduces warpage in each layer, improving alignment reliability during assembly and increasing manufacturing yield by reducing defects from warpage-related misalignment.
Solution Approach 2:
Interposer layers with cavities and nested components act as intermediary structures between dies. These intermediaries provide mechanical support and alignment references that improve alignment reliability while the segmented structure reduces warpage, thereby increasing overall yield.
3Quantity of substance
If finer-pitched interconnects are used, then connection density improves, but alignment precision worsens due to increased sensitivity to warpage
Solution Approach 1:
The packaging substrate is divided into multiple thin interposer layers, which reduces warpage in each individual layer. This segmentation enables the use of finer-pitched interconnects with higher density while maintaining alignment precision, as the reduced warpage minimizes misalignment sensitivity.
Solution Approach 2:
The structural parameters of the substrate are changed by introducing cavities and nested components in the interposer layers. This modifies the mechanical properties to reduce warpage, enabling finer-pitched interconnects to be implemented with maintained alignment precision and improved connection density.
Data Source
AI summary
Embodiments disclosed herein include electronic packages and methods of fabricating electronic packages. In an embodiment, an electronic package comprises an interposer, where a cavity passes through the interposer, and a nested component in the cavity. In an embodiment, the electronic package further comprises a die coupled to the interposer by a first interconnect and coupled to the nested component by a second interconnect. In an embodiment, the first and second interconnects comprise a first bump, a bump pad over the first bump, and a second bump over the bump pad.