Nested Manifold Gas Chambers to Prevent Cell Stack Top Plate Deformation
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Solution Overview
Problem
The temperature increase during operation of a cell stack device can cause the partition plate to thermally expand, potentially deforming the top plate and leading to cracks in the electrochemical cell or its bonding material, necessitating a solution to inhibit top plate deformation.
Innovation Solution
A manifold design without a partition plate, featuring first and second gas channels that communicate at the leading end of the electrochemical cell, with the second manifold main body disposed within the first manifold main body to divide the gas chambers, preventing top plate deformation by eliminating the partition plate and managing temperature distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a partition plate is used to divide gas chambers in the manifold, then the gas supply and collection functions are achieved, but the partition plate undergoes thermal expansion at high temperatures causing top plate deformation
Solution Approach 1:
The patent removes the partition plate from the manifold structure entirely. Instead of using a separate partition component, the gas chambers are defined by the manifold walls and base, eliminating the thermal expansion problem while maintaining gas separation functionality through the manifold's inherent structural design
Solution Approach 2:
The manifold is designed with separate gas supply and collection chambers formed by distinct structural regions within the manifold body itself, rather than using a single chamber divided by a partition plate. This segmentation is achieved through the manifold's internal geometry and gas distribution channels
2Strength
If the partition plate is in contact with the top plate, then structural support is provided, but thermal expansion of the partition plate presses against the top plate causing deformation
Solution Approach 1:
The partition plate is completely removed from the design, eliminating the source of thermal expansion pressure on the top plate. The structural support function is redistributed to the manifold's overall framework, including the base and wall structures that can better accommodate thermal stresses
3Device complexity
If a partition plate is used to divide gas chambers, then the manifold structure is simplified, but the partition plate causes cracks in the electrochemical cell or bonding material due to thermal expansion
Solution Approach 1:
The partition plate is eliminated entirely, removing the cause of cracks in the electrochemical cell and bonding materials. The gas chamber separation is achieved through the manifold's structural design without requiring a separate partition component that would contact and stress the electrochemical cell
Solution Approach 2:
The manifold's internal geometry and gas distribution channels serve as the intermediary mechanism for separating and directing gas flows, replacing the need for a physical partition plate that would directly contact and potentially damage the electrochemical cell components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively inhibits top plate deformation and temperature distribution issues, ensuring the stability and integrity of the electrochemical cell by eliminating the partition plate and optimizing gas chamber configuration.
Implementation Method 1
The temperature of a cell stack device increases during operation, and thus a partition plate thermally expands in some cases
Data Source
AI summary
A manifold includes a first manifold main body and a second manifold main body. The first manifold main body includes a first gas chamber configured to communicate with a first gas channel. The second manifold main body includes a second gas chamber configured to communicate with a second gas channel. The second manifold main body is disposed in the first manifold main body.