Nested MCM Package Structure for Compact Heat Dissipation
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Solution Overview
Problem
Current MCM package structures face challenges with large size, cumbersome packaging processes, and limited heat dissipation, which hinder miniaturization and performance in electronic products.
Innovation Solution
The MCM package structure incorporates a first die with an accommodating recess and a second die fixed through a thermal conductive adhesive, both encapsulated in a plastic layer with electric conductive structures for improved heat dissipation, allowing the thermal conductive adhesive to contact a larger surface area for enhanced heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional MCM package structure is used, then multiple dies can be encapsulated to achieve high integration, but the package size becomes large and heat dissipation performance is limited
Solution Approach 1:
The patent embeds the second die into a recess of the first die, creating a nested configuration where one die is partially inserted into another. This nesting approach reduces the overall package volume while maintaining high integration of multiple dies, directly addressing the contradiction between high integration and large package size.
Solution Approach 2:
The invention transitions from a planar arrangement of dies to a three-dimensional stacked configuration with vertical interconnections. By utilizing the vertical dimension through through-silicon vias and stacked die arrangement, the package achieves higher integration density without proportionally increasing the footprint area, thus reducing overall package size.
2Adaptability or versatility
If traditional MCM package structure is used, then multiple dies can be encapsulated, but the heat dissipation performance remains limited
Solution Approach 1:
The patent extracts the heat dissipation function from the traditional package substrate and assigns it to dedicated heat dissipation electrodes formed on the back surface of each die. These electrodes are directly coupled to heat sinks, creating a separate and optimized thermal management path that efficiently removes heat from the high-power dies while maintaining the integrated multi-die configuration.
Solution Approach 2:
The patent introduces thermal conductive adhesive as an intermediary material between the dies and heat dissipation structures. This adhesive layer with high thermal conductivity efficiently transfers heat from the die substrates to the heat dissipation electrodes and heat sinks, improving overall heat dissipation performance while maintaining the integrated package structure.
3Volume of stationary object
If package miniaturization is pursued, then product size is reduced, but heat dissipation performance becomes crucial and limited
Solution Approach 1:
The patent applies local quality by providing heat dissipation electrodes and heat sink structures specifically at the locations of high-power generating dies, rather than uniform heat management across the entire package. This localized thermal management approach efficiently addresses heat dissipation in critical areas while maintaining compact overall package size.
Solution Approach 2:
The patent employs composite material structures including stacked dies with different material properties, thermal conductive adhesives with optimized thermal conductivity, and composite heat sink structures. These composite materials enable efficient heat dissipation in the miniaturized package by combining materials with complementary thermal and mechanical properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in a compact, high-integration package with improved heat dissipation performance, addressing the limitations of size and heat management in existing MCM structures.
Implementation Method 1
the second die is arranged in the accommodating recess and fixed with the first die through a thermal conductive adhesive
Data Source
AI summary
The present disclosure provides an MCM package structure and manufacturing methods therefor. In the MCM package structure, a first die, a second die, and an electric connection structure are encapsulated in a plastic encapsulation layer, where the first die is provided with an accommodating recess, and an opening of the accommodating recess is located on a back surface of the first die; the second die is arranged in the accommodating recess and fixed with the first die through a thermal conductive adhesive, and an active surface of the second die faces away from an active surface of the first die; a heat dissipation electrode is disposed on a side of a front surface of the plastic encapsulation layer, and the heat dissipation electrode is connected to the thermal conductive adhesive.