Nested Metal Heat Dissipation Structure for Rigid Portable Devices
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Solution Overview
Problem
Existing heat dissipation mechanisms in portable electronic devices face limitations in quickly dissipating heat generated by electronic components without increasing device thickness or reducing mechanical strength, and methods to improve thermal conductivity often lead to decreased rigidity or higher costs.
Innovation Solution
A heat dissipation structure comprising a first frame made of a first metal and a second frame made of a second metal, where the second frame is partially inside the first frame and includes a heat transfer part in contact with the heat generating element and a heat dissipation part at a distance, allowing for efficient heat transfer and dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If graphite sheets or copper sheets are attached to improve thermal conductivity, then heat dissipation performance is improved, but rigidity decreases and device thickness increases
Solution Approach 1:
The patent employs a composite structure combining copper frame (high thermal conductivity) and aluminum alloy frame (lightweight, good thermal conductivity). The copper frame directly contacts heat-generating components for efficient heat transfer, while the aluminum alloy frame provides structural support and additional heat dissipation surface, achieving optimal balance between thermal performance and mechanical strength without increasing device thickness
2Temperature
If the mechanism is made solely of copper or copper alloys to improve thermal conductivity, then heat dissipation performance is improved, but weight and manufacturing cost increase
Solution Approach 1:
The patent applies local quality by using copper material specifically where heat dissipation is most critical (the frame portion directly contacting heat-generating electronic components), while using lighter aluminum alloy for other structural portions. This localized material distribution optimizes thermal conductivity at heat sources while reducing overall device weight and cost
3Ease of manufacture
If a single material mechanism is used, then manufacturing simplicity is maintained, but heat dissipation efficiency is insufficient
Solution Approach 1:
The patent implements a nested frame structure where the copper frame is positioned inside the aluminum alloy frame, with both frames working together as an integrated heat dissipation system. The copper frame contacts heat-generating components first, transferring heat to the aluminum alloy frame which provides additional heat dissipation surface area, achieving enhanced heat dissipation efficiency while maintaining manufacturing feasibility through modular assembly
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed structure effectively dissipates heat without increasing device thickness or reducing mechanical strength, while maintaining rigidity and reducing manufacturing costs.
Implementation Method 1
a heat transfer part that is in contact with the heat generating element and a heat dissipation part that is disposed at a distance from the heat generating element
Data Source
AI summary
An example electronic device may include a heat generating element including an electronic component in which heat is generated during the operation of the electronic device; and a heat dissipation structure configured to support the heat generating element, wherein the heat dissipation structure includes a first frame including a first metal, and a second frame, at least a portion of which is disposed inside the first frame, at least a portion of which is exposed to the outside through one surface of the first frame, and which includes a second metal, and the second frame includes a heat transfer part that is in contact with the heat generating element and a heat dissipation part that is disposed at a distance from the heat generating element, and may extend from the heat transfer part to the heat dissipation part.