Nested PCB Assemblies for High Density and Serviceability
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Solution Overview
Problem
Standard chassis sizes limit the number of components and resources that can fit in data storage systems, restricting component and power densities in computing systems.
Innovation Solution
The configuration of nested and interleaved printed circuit board (PCB) assemblies within a chassis, allowing for increased component and power densities while maintaining mechanical clearance for easy servicing and thermal decoupling, includes inverted PCB assemblies with interleaved components and power modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If standard chassis sizes are used, then manufacturing and servicing are simplified, but component density and power density are limited
Solution Approach 1:
The patent implements nested PCB assemblies where a first PCB assembly is positioned within a second PCB assembly, and a third PCB assembly is positioned within the first. This nested configuration allows multiple components to occupy overlapping spatial footprints, dramatically increasing component density within the same chassis volume without requiring larger or more complex chassis structures.
Solution Approach 2:
The patent transitions from traditional planar component arrangement to three-dimensional nested positioning. By stacking PCB assemblies in vertical layers with interleaved power modules positioned between them, the design utilizes the vertical dimension to accommodate more components and power modules within the same horizontal footprint, thereby increasing both component density and power density.
2Quantity of substance
If component density is increased, then system capacity improves, but thermal management becomes more difficult
Solution Approach 1:
The patent extracts power modules from the traditional PCB-mounted configuration and positions them as separate interleaved components between nested PCB assemblies. This separation allows dedicated thermal management for power-intensive components, with each power module having its own heatsink and thermal pathway, preventing heat accumulation from compromising the thermal decoupling of memory modules while maintaining high component density.
Solution Approach 2:
The patent applies different thermal management solutions to different components based on their specific thermal requirements. Memory modules on PCB assemblies have their own thermal pathways, while interleaved power modules have separate heatsinks and thermal management. This localized thermal management approach allows high component density while maintaining adequate thermal decoupling between different component types.
3Quantity of substance
If PCB assemblies are nested and interleaved, then component and power densities increase, but mechanical clearance for servicing may be compromised
Solution Approach 1:
The patent divides the computing system into modular nested PCB assemblies that can be independently accessed and serviced. Each PCB assembly is a discrete unit with standardized interfaces, allowing technicians to remove and service individual assemblies without disassembling the entire system. This segmentation maintains serviceability despite the nested configuration by creating clear access paths and standardized service interfaces.
Solution Approach 2:
The patent incorporates movable and adjustable components within the nested assembly structure. Power modules and certain PCB components are designed with movable mounting mechanisms that allow them to be accessed and serviced by sliding or rotating them into accessible positions, maintaining ease of operation despite the compact nested arrangement.
Data Source
AI summary
A rack unit configuration is described that includes a first printed circuit board (PCB) assembly interleaved with a second PCB assembly that is inverted with respect to the first PCB assembly. The configuration of the first PCB assembly and the second PCB assembly allow for increased component and power densities within computing systems, memory systems, etc. The increased density may be achieved while allowing sufficient mechanical clearance to allow easy component replacement and servicing (e.g., and hot pluggability). Power density may also be increased with PCB assemblies including nested and interleaved power modules.