Nested Pin Assembly Structure for Compact Travel Adapters
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Solution Overview
Problem
The side-by-side arrangement of multiple pin units in existing adapters results in a large transverse size, compromising portability during international travel due to different power socket standards.
Innovation Solution
A compact pin assembly structure with multiple pin specifications, featuring a frame, housing, and pin assembly where pin units are slidably connected, including telescopic components and recessed structures to minimize transverse and vertical sizes, allowing for multiple pin types and stable movement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple pin units are arranged side by side to adapt to different socket standards, then the adapter can be compatible with multiple regions, but the transverse size of the pin assembly becomes large, resulting in poor portability
Solution Approach 1:
The patent applies nesting by placing the first pin unit inside the second pin unit. The first telescopic component with first pin can be retracted into the frame, and the frame itself can be inserted into the second telescopic component with second pin, creating a nested configuration that significantly reduces the transverse size while maintaining multiple pin specifications for different socket standards
Solution Approach 2:
The patent uses telescopic components that can extend and retract dynamically. The first telescopic component and second telescopic component allow the pin units to change their configuration from extended (for use) to retracted (for compact storage), enabling the adapter to transition between functional and portable states
2Adaptability or versatility
If multiple pin units are arranged side by side within the housing, then the adapter supports multiple pin specifications, but the overall size of the adapter increases, compromising portability
Solution Approach 1:
The patent implements nesting by having the first pin unit (with first telescopic component and first pin) nested within the second pin unit (with second telescopic component and second pin). This nested arrangement allows both pin units to coexist in a compact configuration, reducing the overall volume of the adapter while maintaining support for multiple pin specifications
Solution Approach 2:
The patent transitions from a two-dimensional side-by-side arrangement to a three-dimensional nested arrangement. By utilizing the vertical dimension and allowing pins to extend perpendicular to the housing surface, the design achieves compactness in the transverse plane while accommodating multiple pin types through vertical stacking and telescopic mechanisms
Data Source
AI summary
A pin assembly structure includes a frame, a housing and a pin assembly. The frame is mounted in the housing. The pin assembly includes a first pin unit and a second pin unit. The first pin unit and the second pin unit are slidably connected on the frame along a vertical direction. The first pin unit includes a first telescopic component and a first linkage component. The second pin unit includes a second telescopic component, which is fixedly provided with a second pin, and the second pin is a three-pole pin whose three poles respectively corresponding to an earth wire, a live wire and a neutral wire. a side of the first linkage component corresponding to the second pin unit is provided with a recessed structure, so that a pole of the three-pole pin corresponding to the E wire is embedded in the side of the first linkage component.