Nested Refrigerant Pipe Structure to Prevent Condensation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate treating apparatuses face challenges in reducing the outer diameter of pipes while preventing condensation, as they require thick heat insulation materials to manage low temperatures, which increases pipe thickness and leads to bending issues due to refrigerant shrinkage.
Innovation Solution
A substrate treating apparatus design featuring an inner pipe surrounded by an outer pipe with a suction space in between, where the spacing maintaining part ensures the inner pipe is spaced apart and not in direct contact, allowing for a reduced outer diameter without the need for external insulation, and includes features like temperature and pressure sensors for leak detection and an anti-bending mechanism to prevent pipe deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a thick heat insulating material is wrapped around the pipe to prevent condensation, then condensation is prevented, but the outer diameter of the pipe increases making it difficult to find mounting space
Solution Approach 1:
The patent implements a nested pipe structure where an inner pipe carrying the refrigerant is placed inside an outer pipe. The suction space between the inner and outer pipes creates an insulating barrier that prevents condensation on the outer surface, eliminating the need for additional external insulation materials while maintaining a compact outer diameter.
2Temperature
If the pipe is cooled to very low temperatures to cool the substrate, then substrate temperature is reduced improving etch rate, but the pipe shrinks and bends
Solution Approach 1:
The outer pipe acts as a protective shell that constrains the inner pipe, preventing it from bending or deforming due to thermal shrinkage at low temperatures. The suction space between the pipes also provides thermal insulation that reduces the magnitude of temperature-induced shrinkage.
Solution Approach 2:
The suction space between the inner and outer pipes provides localized thermal insulation precisely where needed, reducing heat transfer and minimizing temperature-induced dimensional changes in the refrigerant pipe without affecting the overall cooling performance.
3Device complexity
If the inner pipe and outer pipe are in direct contact to simplify structure, then device complexity is reduced, but heat transfer increases causing condensation
Solution Approach 1:
The nested pipe configuration with a suction space between the inner and outer pipes creates a natural insulating barrier. This structure prevents direct thermal contact while maintaining structural simplicity, as the suction space itself serves as the insulation layer without requiring additional materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents condensation and reduces the outer diameter of the substrate treating apparatus, maintaining operational efficiency while avoiding the issues of pipe thickness and bending caused by refrigerant shrinkage.
Implementation Method 1
an intake part connected to the suction space, and for sucking the suction space
Implementation Method 2
an inner pipe connected to the process chamber and for supplying a heat exchange fluid to an interior of the process chamber
Implementation Method 3
The straightness of the ions and/or radicals contained in the plasma is an important factor in determining the selectivity of the substrate. When the substrate is treated to improve the straightness of the ions and/or radicals, the temperature of the electrostatic chuck supporting the substrate is lowered.
Implementation Method 4
a cooler connected to the inner pipe, and for cooling the heat exchange fluid and supplying the cooled heat exchange fluid to the inner pipe
Data Source
AI summary
Disclosed are a substrate treating apparatus and a fluid supply unit that reduce the outer diameter while preventing condensation from occurring even without wrapping a pipe supplying a refrigerant with a heat insulating material. The substrate treating apparatus includes: a process chamber having a treatment space for treating a substrate; an inner pipe connected to the process chamber and for supplying a heat exchange fluid to an interior of the process chamber; a cooler connected to the inner pipe, and for cooling the heat exchange fluid and supplying the cooled heat exchange fluid to the inner pipe; an outer pipe disposed on an outer side of the inner pipe while surrounding the inner pipe to form a suction space between the inner pipe and the outer pipe; an intake part connected to the suction space, and for sucking the suction space; and a spacing maintaining part disposed in the suction space, and for maintaining a spacing distance between the inner pipe and the outer pipe.


