Nested Package-on-Package Layout to Prevent Die Overhang
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Solution Overview
Problem
Current package-on-package (PoP) systems face issues such as overhang and bending of semiconductor dies, delamination of silicon spacers, voids in mold compounds, and inaccessibility of passive components, leading to errors and resource wastage due to end-to-end package development requirements.
Innovation Solution
The modular system comprises a main module package with a substrate and ASIC, and an upper module package with semiconductor dies, where the upper module package is designed to fit within the footprint of the main module package, eliminating the need for silicon spacers and allowing separate assembly and testing, with the mold compound constrained to the upper module package to maintain accessibility of passive components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If semiconductor dies are stacked over ASIC in PoP system, then component density is improved, but overhang and bending of semiconductor dies occur
Solution Approach 1:
The upper module package is nested within the footprint of the main module package, with the substrate of the upper module positioned over the ASIC such that the semiconductor dies are fully supported within the boundaries of the main module package substrate, eliminating overhang and bending issues while achieving high component density
2Strength
If silicon spacers are used to support semiconductor dies, then die support is improved, but delamination of silicon spacers occurs
Solution Approach 1:
The invention extracts and eliminates the silicon spacer component entirely from the PoP system. The substrate of the upper module package directly supports the semiconductor dies through its cavity structure and footprint design, removing the intermediate silicon spacer layer that causes delamination while maintaining adequate die support
3Object-affected harmful factors
If mold compound is applied over entire PoP system, then encapsulation is improved, but passive components become inaccessible
Solution Approach 1:
The mold compound is applied selectively only to the upper module package rather than the entire PoP system. This localized encapsulation protects the semiconductor dies and interconnects in the upper module while leaving the passive components on the main module package substrate exposed and accessible for debugging and replacement operations
4Reliability
If end-to-end package development is used, then integration is improved, but errors and resource wastage increase
Solution Approach 1:
The PoP system is segmented into two independently developable and testable module packages. The main module package and upper module package can be developed, tested, and validated separately before final integration, allowing errors to be identified and corrected in isolated modules rather than requiring complete package rework, thereby reducing resource wastage while maintaining integration reliability
Data Source
AI summary
Modular systems in packages, and associated devices, systems, and methods, are disclosed herein. In one embodiment, a system comprises a main module package and an upper module package. The main module package includes a first substrate and a first electronic device mounted on a first side of the first substrate. The upper module package includes a second substrate and one or more second electronic devices mounted on a first side of the second substrate. The second substrate includes a cavity at a second side of the second substrate opposite the first side, and the upper module package is mountable on the first side of the first substrate of the main module package such that the first electronic device is positioned within the cavity and the second substrate generally surrounds at least a portion of a perimeter of the first electronic device.