Nested Semiconductor Container Structure for Power Module Cooling
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Solution Overview
Problem
Current semiconductor devices face challenges in effectively managing heat dissipation, which can lead to temperature rises and potential device failure, especially in high-power applications like railroad vehicles and renewable-energy systems.
Innovation Solution
The semiconductor device employs a dual-container structure with a refrigerant-filled space between the inner and outer containers, utilizing a heat dissipation member and insulating films to efficiently transfer heat from semiconductor elements to a refrigerant, while maintaining electrical insulation and preventing corrosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single package structure is used to integrate multiple power semiconductors, then device complexity is reduced and productivity is improved, but heat dissipation efficiency deteriorates leading to temperature rise
Solution Approach 1:
The container is divided into multiple independent chambers, each housing a separate power semiconductor device. This segmentation allows each chamber to dissipate heat independently, preventing heat accumulation that would occur in a single integrated package, thereby resolving the contradiction between simplified structure and heat dissipation efficiency.
Solution Approach 2:
Multiple containers are nested within a single package structure, with each container holding individual semiconductor devices. This nested arrangement maintains the simplicity of a single package from the outside while creating independent thermal zones internally, allowing efficient heat dissipation without increasing overall device complexity.
2Volume of moving object
If containers are placed close together to reduce device size, then volume is reduced, but heat dissipation efficiency deteriorates and reliability decreases
Solution Approach 1:
Each container is equipped with dedicated heat dissipation structures and refrigerant channels tailored to its specific thermal requirements. This local customization ensures optimal heat dissipation for each semiconductor device while maintaining compact overall dimensions, preventing the reliability issues that would arise from uniform, inadequate heat management in a compact design.
Solution Approach 2:
A refrigerant circulation system acts as an intermediary between the semiconductor devices and the external environment, efficiently transferring heat from each compact container to the refrigerant. This intermediary mechanism enables reliable heat dissipation in a reduced volume by mediating the thermal transfer process.
3Temperature
If heat dissipation structures are added to manage temperature, then temperature control is improved, but device complexity increases
Solution Approach 1:
The container walls serve multiple functions: they provide structural containment for the semiconductor devices, act as thermal conduction paths for heat dissipation, and form channels for refrigerant circulation. This multi-functionality achieves effective temperature control without adding separate, complex heat dissipation structures.
Solution Approach 2:
The heat dissipation function is merged with the container structure itself, rather than being implemented as separate components. The container walls are designed to conduct heat and facilitate refrigerant flow, combining structural and thermal management functions into a single integrated element, thereby controlling temperature without increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively controls temperature rises by efficiently dissipating heat to the refrigerant, reducing the risk of device failure and enhancing operational reliability in high-power applications.
Implementation Method 1
utilizing a heat dissipation member and insulating films to efficiently transfer heat from semiconductor elements to a refrigerant
Implementation Method 2
The space between the outer container and the inner container is filled with a refrigerant... efficiently dissipating heat to the refrigerant
Data Source
AI summary
According to one embodiment, a semiconductor device includes a first container and a second container. The second container is inside the first container. A semiconductor element is inside the second container. The second container is formed of a lower portion, a side portion fixed to the lower portion, and an upper portion fixed to the side portion and the first container. The side portion is a first metal material covered with a first insulator. The lower portion and the side portion of the second container are spaced from the first container. The semiconductor device may be used as a power module or the like in some instances, and the semiconductor element may be one or more transistors of the like.