Nested Semiconductor Assembly Without Spacer-Induced Cracking

Solution Overview

Problem

Conventional semiconductor packaging methods using spacers for stacking devices are costly, difficult to implement, and pose challenges with coplanarity and cracking, necessitating a more efficient and cost-effective solution.

Innovation Solution

A nested semiconductor assembly design where a larger device has a cavity formed in its backside to accommodate a smaller device, ensuring co-planarity and ease of manufacturing, eliminating the need for separate spacers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If spacers are used for stacking semiconductor devices, then device stacking is achieved, but manufacturing cost increases and manufacturing complexity increases

Engineering Contradiction:

Improvedevice stackingVSAvoidmanufacturing cost

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The support function previously performed by separate spacer components is merged into the semiconductor device substrate itself. The substrate is designed with an integrated support structure that provides both mechanical support for stacking and electrical connection functions, eliminating the need for separate spacer components and reducing manufacturing complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The substrate is designed to perform multiple functions: it serves as the base for mounting active components, provides mechanical support for device stacking, and offers electrical connection pathways. This multi-functional design eliminates the need for separate spacer components and reduces the overall number of parts required in the assembly.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Productivity

If spacers are used for stacking semiconductor devices, then device stacking is achieved, but device complexity increases

Engineering Contradiction:

Improvedevice stackingVSAvoidassembly complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The support function previously performed by separate spacer components is merged into the semiconductor device substrate itself. The substrate is designed with an integrated support structure that provides both mechanical support for stacking and electrical connection functions, eliminating the need for separate spacer components and reducing manufacturing complexity.

Inventive Principle:

Principle #5Merging (Combining)

3Productivity

If spacers are used for stacking semiconductor devices, then device stacking is achieved, but reliability decreases due to cracking risk

Engineering Contradiction:

Improvedevice stackingVSAvoidcracking resistance

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The support function previously performed by separate spacer components is merged into the semiconductor device substrate itself. The substrate is designed with an integrated support structure that provides both mechanical support for stacking and electrical connection functions, eliminating the need for separate spacer components and reducing manufacturing complexity.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS12564096B2Nested semiconductor assemblies and methods for making the same

Publication Date: 2026.02.24 MICRON TECHNOLOGY INC

AI summary

A semiconductor device assembly is provided. The assembly includes an outer semiconductor device which has an active surface and a back surface. The back surface includes a cut that extends to a depth between the active surface and the back surface, and uncut regions on opposing sides of the cut. The assembly further includes an inner semiconductor device disposed within the cut of the outer semiconductor device.