Multilayer Inductor with Nested Spiral Wirings for Power Amplifier Modules
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Solution Overview
Problem
Existing power amplifier modules fail to achieve sufficient inductance while minimizing conductor loss, leading to inadequate performance in power supply voltage transfer and leakage reduction.
Innovation Solution
The design incorporates first and second spiral-shaped wirings on a multilayer substrate with dielectric layers, where the second wiring is narrower than the first, and both are electrically connected in parallel, optimizing inductance and reducing magnetic field intensity and resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the thickness of conductors having inductor function is increased to reduce resistance loss, then conductor loss is reduced, but inductance remains insufficient
Solution Approach 1:
The patent transitions from planar spiral patterns to three-dimensional vertically stacked spiral patterns. The first and second wirings are formed on different layers (first surface and second surface) of the multilayer substrate, creating a vertical stacking configuration that increases inductance through spatial layering while maintaining reduced resistance through optimized conductor thickness in each layer.
Solution Approach 2:
The second wiring is positioned such that its projected image is entirely contained within the projected image of the first wiring when both are projected onto the first surface. This nested arrangement creates magnetic flux coupling between the two spiral wirings, significantly enhancing the overall inductance value while allowing each individual wiring to maintain optimized thickness for low resistance.
2Reliability
If a single thick conductor is used to achieve high inductance, then inductance increases, but magnetic field intensity increases and resistance does not sufficiently decrease
Solution Approach 1:
The inductor is divided into multiple separate conductor segments (first wiring and second wiring) stacked vertically rather than using a single thick conductor. This segmentation distributes the current path across multiple layers, reducing the magnetic field intensity generated by any single conductor while the vertical stacking and nested arrangement maintain high overall inductance through flux coupling.
3Loss of energy
If conductor width is increased to reduce resistance, then resistance decreases, but inductance becomes insufficient
Solution Approach 1:
The solution moves from increasing conductor width in a single plane to increasing conductor thickness in the vertical dimension. By forming conductors on multiple stacked layers with optimized thickness, the patent achieves low resistance through increased conductive cross-section while generating high inductance through the vertical stacking geometry and magnetic flux coupling between layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances inductance while minimizing resistance and magnetic field intensity, resulting in improved power transfer efficiency and reduced leakage, thus addressing the limitations of existing power amplifier modules.
Implementation Method 1
The inductor includes first and second wirings. The first wiring is formed in a substantially spiral shape on a first surface of a multilayer substrate. The second wiring is formed in a substantially spiral shape on a second surface of the multilayer substrate.
Data Source
AI summary
An inductor includes first and second wirings respectively formed in a substantially spiral shape on first and second surfaces of a multilayer substrate. The multilayer substrate includes plural dielectric layers stacked on each other in a predetermined direction. The multilayer substrate includes a first layer having the first surface, which is an end surface in the predetermined direction, and a second layer having the second surface within the multilayer substrate. The width of the second wiring is smaller than that of the first wiring. The first and second wirings are electrically connected in parallel with each other. The inductance of the first wiring and that of the second wiring are substantially equal to each other. When the first and second wirings are projected on the first surface in the predetermined direction, entirety of a projected image of the second wiring is contained within that of the first wiring.