Nested Storage Chassis with Interposer Card for High Density
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Solution Overview
Problem
As storage devices shrink in size, it becomes challenging to maintain high data storage density within a reduced enclosure space without compromising thermal performance or service accessibility, particularly in rack-mounted systems, due to difficulties in delivering power and signals while ensuring adequate airflow.
Innovation Solution
The design incorporates a storage chassis with dual redundant, hot-swappable power supplies and input/output modules at the rear, and vertically oriented field replaceable units (FRUs) with interposer cards and flexible connectors to allow for increased density without sacrificing thermal performance or accessibility, enabling up to 24 FRUs in a 2U height profile.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If storage devices are mounted one in front of another in a drive module to increase density, then data storage density is improved, but power and signal delivery becomes difficult without impinging on airflow
Solution Approach 1:
The patent implements a nested configuration where a second storage device is positioned behind the first storage device within the same drive module. The rear portion of the first storage device and the front portion of the second storage device overlap in the depth direction, allowing one device to be nested within the spatial envelope of another. This nesting arrangement increases storage density while maintaining separate access paths for power and signal connections through the chassis rear panel.
Solution Approach 2:
The patent transitions from a traditional side-by-side or stacked arrangement to a depth-oriented nested arrangement along the longitudinal axis of the chassis. By utilizing the depth dimension more effectively and allowing overlap in the Z-direction, the system accommodates more storage devices without compromising airflow paths or electrical connection accessibility.
2Quantity of substance
If storage device size is decreased to increase density, then data storage density is improved, but thermal performance deteriorates due to reduced airflow
Solution Approach 1:
The patent provides localized airflow channels and spacing arrangements specifically designed for each nested storage device configuration. Airflow paths are optimized to pass between and around the nested devices, ensuring that each device receives adequate cooling despite the compact nested arrangement. The chassis structure incorporates localized features that maintain thermal performance while enabling high-density nesting.
3Quantity of substance
If more storage devices are included in a reduced enclosure space, then data storage density is improved, but service accessibility deteriorates
Solution Approach 1:
The patent extracts the electrical connection interface from the front of the storage devices and relocates it to the rear chassis panel. Power and signal connections are accessed through rear-mounted connectors and cable assemblies, allowing service personnel to perform electrical connections and disconnections without removing the storage devices from their nested positions. This extraction of the connection function maintains service accessibility while preserving the high-density nested configuration.
4Quantity of substance
If storage devices are arranged in a nested configuration, then data storage density is improved, but airflow between devices is impeded
Solution Approach 1:
The patent segments the airflow path into multiple channels that navigate around and between the nested storage devices. Rather than a single bulk airflow path, the chassis design creates separated airflow streams that can access each device individually. This segmentation of the fluid flow ensures that the nested configuration does not create significant airflow bottlenecks or dead zones, maintaining cooling efficiency despite the compact arrangement.
Data Source
AI summary
The present disclosure provides a chassis housing an increased density of smaller storage devices. The chassis houses one or more power supplies, one or more input/output modules, and hot swappable, front accessible field replaceable units. The field replaceable units have a depth that is greater than their width and height, so as to accommodate dual storage devices one in front of the other. The proximal storage device connects to a midplane of the chassis via an interposer card situated between the proximal and distal storage devices. The interposer card conditions any signals that exhibit signal integrity problems after traversing between the midplane and the interposer card. The interposer card connects to the midplane via a bridge card and a flexible connector running underneath the distal storage device. Each field replaceable unit is placed into the front end of the chassis in a vertical orientation with respect to the chassis.