Nested Instrumented Substrate for High-Temperature Chamber Measurement
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Solution Overview
Problem
Current methods fail to monitor temperature in semiconductor processing environments under extreme high-temperature conditions without contaminating the processing chamber, necessitating a system to acquire measurement parameters effectively in high-temperature processes.
Innovation Solution
An instrumented substrate apparatus with a nested enclosure assembly, including an inner and outer enclosure, houses an electronic assembly and sensors, using an insulating medium to maintain the electronic assembly at a lower temperature, allowing for accurate measurement parameter acquisition at high temperatures up to 800°C while preventing contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If an instrumented substrate is placed in a high temperature processing chamber to monitor temperature, then temperature measurement capability is improved, but the electronic assembly would be damaged by high temperature
Solution Approach 1:
The patent implements a nested enclosure assembly where an inner enclosure housing the electronic assembly is placed inside an outer enclosure that is positioned on the substrate. This nested structure allows the electronic components to be thermally isolated from the high-temperature processing environment while remaining part of the instrumented substrate system, enabling temperature monitoring without exposing sensitive electronics to damaging heat.
Solution Approach 2:
The patent introduces an insulating medium as an intermediary between the outer enclosure and the inner enclosure. This insulating layer acts as a thermal barrier that blocks heat transfer from the high-temperature processing chamber to the electronic assembly, allowing the electronics to operate at safe temperatures while the substrate experiences processing temperatures up to 800°C or higher.
2Temperature
If sensors are exposed to high temperature for measurement, then measurement range is improved, but contamination of the processing chamber occurs
Solution Approach 1:
The patent extracts the electronic assembly and critical sensing components from the direct high-temperature processing environment by housing them within the nested enclosure assembly. The outer enclosure is positioned on the substrate to sense temperature, while the inner enclosure containing electronics is thermally isolated, effectively removing sensitive components from the contamination-prone high-temperature zone while maintaining measurement capability.
Solution Approach 2:
The nested enclosure structure creates multiple containment levels where the inner enclosure housing electronics is nested within the outer enclosure that interfaces with the substrate. This nested arrangement allows temperature sensing at the substrate interface while keeping electronic components isolated in a protected inner chamber, preventing contamination of the processing chamber.
3Device complexity
If the electronic assembly is housed in a single enclosure, then device complexity is reduced, but thermal insulation effectiveness is insufficient
Solution Approach 1:
The patent employs a nested enclosure assembly with an outer enclosure and an inner enclosure, where the inner enclosure is positioned within the outer enclosure. This nested structure provides enhanced thermal insulation effectiveness by creating multiple thermal barriers, while the overall design remains integrated with the substrate to maintain relatively simple device architecture.
Solution Approach 2:
An insulating medium is introduced as an intermediary material between the outer enclosure and the inner enclosure. This insulating layer significantly improves thermal insulation performance by blocking heat transfer pathways, allowing the electronic assembly to be protected from high temperatures without requiring overly complex active cooling systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise temperature measurement across semiconductor processing chambers, maintaining the electronic assembly at a safe temperature and preventing contamination, thus enhancing process monitoring and control.
Implementation Method 1
an insulating medium is disposed within a cavity between the outer surface of the inner enclosure and the inner surface of the outer enclosure
Data Source
AI summary
An apparatus includes an instrumented substrate apparatus, a substrate assembly including a bottom and top substrate mechanically coupled, an electronic assembly, a nested enclosure assembly including an outer and inner enclosure wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses the electronic assembly. An insulating medium between the inner and outer enclosure and a sensor assembly communicatively coupled to the electronic assembly including one or more sensors disposed at one or more locations within the substrate assembly wherein the electronic assembly is configured to receive one or more measurement parameters from the one or more sensors.