Nested Terahertz Antenna Impedance Matching

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Solution Overview

Problem

In the terahertz range, existing technologies face challenges in creating a compact electromagnetic wave sensor or emitter with high efficiency due to impedance mismatching between radiating elements and feeding units, particularly when multiple frequency bands are involved, as current VLSI technology is limited in manufacturing large focal plane arrays (FPAs) and impedance matching circuits are not well developed.

Innovation Solution

The design incorporates multiple antennas where one radiating element surrounds another, allowing direct impedance matching without the need for matching circuits, with the second radiating element being sensitive to a different frequency band and polarization, reducing the overall size and maintaining high efficiency by minimizing interference between antennas.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If multiple antennas are connected together to reduce size, then the device becomes more compact, but impedance matching deteriorates due to current distribution perturbation

Engineering Contradiction:
Improvedevice sizeVSAvoidimpedance matching
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The patent applies nesting by placing one radiating element inside another radiating element, creating a compact multi-frequency antenna structure. The inner radiating element is positioned within the outer radiating element, allowing both elements to coexist in a small volume while maintaining their respective impedance characteristics through proper spatial arrangement and electrical isolation.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent segments the antenna system into multiple independent radiating elements, each designed to operate at different frequency bands. By dividing the antenna into separate segments (outer and inner radiating elements) with independent feeding mechanisms, the system achieves multi-frequency operation without compromising impedance matching, as each segment can be optimized independently.

Inventive Principle:
Principle #1Segmentation

2Loss of energy

If a matching circuit is added to achieve impedance matching, then efficiency improves, but device complexity increases

Engineering Contradiction:
ImproveefficiencyVSAvoidcircuit complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The patent implements self-service by designing the radiating elements to inherently provide impedance matching through their geometric configuration and spatial arrangement. The radiating elements are designed with specific dimensions and orientations that naturally achieve conjugate matching with the feeding unit, eliminating the need for external matching circuits and reducing overall system complexity while maintaining high efficiency.

Inventive Principle:
Principle #25Self-service

3Adaptability or versatility

If the FPA size is increased to accommodate multiple frequency sensitivities, then measurement capability improves, but manufacturing feasibility deteriorates due to VLSI limitations

Engineering Contradiction:
Improvefrequency sensitivityVSAvoidmanufacturing feasibility
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent uses nesting to place multiple radiating elements with different frequency sensitivities in a compact arrangement, allowing the FPA to maintain multi-frequency capability without requiring a large physical size that would exceed VLSI manufacturing limits. The nested configuration enables high adaptability within a manufacturable footprint.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent transitions from a two-dimensional planar arrangement to a three-dimensional nested configuration, stacking radiating elements in multiple layers and dimensions. This dimensional change allows multiple frequency-sensitive elements to be packed into a compact volume, maintaining versatility while staying within standard wafer size constraints for VLSI manufacturing.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS9893423B2Electromagnetic wave sensor and/or emitter
Publication Date: 2018.02.13 CANON KK
  • US9893423B2 patent drawing
  • US9893423B2 patent drawing
  • US9893423B2 patent drawing

AI summary

Provided is a device for performing at least one of detection and emission of electromagnetic waves, including a plurality of antennas, in which a first antenna includes a first radiating element and a first electronic element electrically connected to the first radiating element, and is sensitive to a first frequency band, and in which a second antenna includes a second radiating element and a second electronic element electrically connected to the second radiating element, and is sensitive to a second frequency band. At least a part of the second radiating element is arranged inside the first radiating element.