Nested Through Glass Via Transformer for High Q Factor

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Solution Overview

Problem

Conventional 3D transformers face challenges in achieving high coupling efficiency and a strong Q factor due to the large pitch of through glass vias (TGVs), leading to inefficient use of area and reduced inductor coupling efficiency.

Innovation Solution

A 3D nested transformer design is implemented using through glass vias (TGVs) with conformal-plated layers and a core, where multiple inductors are efficiently coupled within a single TGV footprint, enabling high-Q factor and high coupling efficiency while conserving area, by daisy chaining through substrate vias with traces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional through glass vias (TGVs) are used in 3D transformers, then the structure is simple to manufacture, but the pitch is large leading to reduced inductor coupling efficiency and lower Q factor

Engineering Contradiction:
Improveinductor coupling efficiencyVSAvoidvia structure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent implements nested through substrate vias where multiple conductive regions are arranged concentrically within a single via footprint. The first and second conductive regions are positioned at different depths and radii, creating a nested configuration that increases coupling efficiency without expanding the lateral pitch between vias.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The invention transitions from a 2D planar via structure to a 3D nested structure by adding vertical layering and radial positioning of multiple conductive regions within the same via footprint. This dimensional transformation allows multiple inductors to be coupled through a single via location, improving coupling efficiency while maintaining compact area.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Area of stationary object

If conventional TGVs with large pitch are used, then the device area is larger, but the inductor coupling efficiency is reduced

Engineering Contradiction:
Improvetransformer area footprintVSAvoidcoupling efficiency
Core Design Contradiction:
Area of stationary objectVSManufacturing precision

Solution Approach 1:

The patent merges multiple via functions into a single nested via structure. By placing first and second conductive regions within the same via footprint, the design combines what would traditionally require separate vias into one integrated structure, reducing the area footprint while maintaining coupling efficiency.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The nested configuration allows multiple conductive regions to occupy the same spatial footprint by positioning them at different radial distances and vertical levels. This nesting approach enables multiple inductor connections within a compact area, simultaneously reducing the transformer's overall area while improving coupling efficiency.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Manufacturing precision

If nested through substrate vias with multiple conductive regions are implemented, then coupling efficiency and Q factor are improved, but the via structure becomes more complex

Engineering Contradiction:
ImproveQ factorVSAvoidconductive region structure
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The nested via structure is segmented into distinct conductive regions with specific functions. The first conductive region couples to one set of inductors while the second conductive region couples to another set, allowing independent optimization of each coupling path and achieving high Q factor through precise segmentation of electromagnetic coupling.

Inventive Principle:
Principle #1Segmentation

4Productivity

If daisy chaining traces through multiple conductive regions is implemented, then resource utilization is enhanced, but the trace routing complexity increases

Engineering Contradiction:
Improveresource utilization efficiencyVSAvoidtrace routing complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The nested via structure serves multiple functions simultaneously: it provides electromagnetic coupling between inductors, acts as a grounding path, and enables daisy-chained trace routing. This multi-functionality enhances resource utilization by making each via structure serve several purposes, from coupling to signal routing to grounding.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The 3D nested transformer design achieves improved coupling efficiency and a higher Q factor compared to conventional designs, with a reduced area footprint, enabling efficient resource utilization and enhanced performance in transformer applications.

Implementation Method 1

A current that varies in the primary winding creates a varying magnetic flux in the core of the transformer that creates a varying magnetic flux through the secondary winding. This varying magnetic flux then induces a varying electromotive force (e.g., a voltage) in the secondary winding.

Methodology Applied
Scientific EffectInductive coupling: Electromagnetic Induction

Data Source

PatentUS9384883B2Nested through glass via transformer
Publication Date: 2016.07.05 QUALCOMM INC
  • US9384883B2 patent drawing
  • US9384883B2 patent drawing
  • US9384883B2 patent drawing

AI summary

A 3D nested transformer includes a substrate having a set of through substrate vias daisy chained together with a set of traces. At least some of the through substrate vias have first and second conductive regions. The set of traces also includes a first set of traces coupling together at least some of the first conductive regions of the through substrate vias, and a second set of traces coupling together at least some of the second conductive regions of the through substrate vias.