Nested Vapor Chambers for High-Power Processor Heat Dissipation
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Solution Overview
Problem
Current heat dissipation methods, such as thermal paste and heat sinks, are inadequate for effectively managing the high heat generated by high-power processors, resulting in poor overall heat dissipation efficiency.
Innovation Solution
A heat dissipation device comprising a first vapor chamber and a second vapor chamber with capillary structures and support units, where the second vapor chamber is designed to increase the contact area of vaporized working fluid, enhancing heat absorption and dissipation through capillary action and fin sets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional heat dissipation methods (thermal paste or heat sinks) are used, then the structure is simple, but the heat dissipation efficiency is insufficient for high-power processors
Solution Approach 1:
The patent employs a nested structure where a second vapor chamber is disposed on top of the first vapor chamber, with the second chamber's bending portions inserted into openings of the first chamber. This nested arrangement increases the contact area of vaporized working fluid without requiring a completely separate heat dissipation system, thereby improving heat dissipation efficiency while maintaining reasonable structural complexity
Solution Approach 2:
The patent introduces a vertical dimension by stacking two vapor chambers one on top of the other, rather than expanding horizontally. The second vapor chamber extends upward from the first chamber, utilizing the vertical space to increase heat dissipation surface area and working fluid contact area without significantly increasing the horizontal footprint
2Reliability
If heat dissipation components use phase change of working fluid, then heat conduction is improved, but the components cannot maintain effective heat dissipation for large amounts of heat energy from high-power processors
Solution Approach 1:
The patent merges two vapor chambers into a single integrated heat dissipation system. The first and second vapor chambers are connected through bending portions that insert into openings, allowing the working fluid to circulate through both chambers as a unified system. This combination increases the total contact area for vaporized working fluid, enabling the system to handle larger amounts of heat energy from high-power processors
Solution Approach 2:
The nested arrangement of the second vapor chamber on the first vapor chamber allows the working fluid to utilize both chambers sequentially, effectively increasing the heat dissipation capacity without requiring a proportionally larger single chamber
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves higher heat dissipation efficiency and consistent heat management for high-power processors by increasing the contact area of vaporized working fluid, allowing for efficient heat absorption and dissipation.
Implementation Method 1
a capillary layer (15) disposed on the first lower cover (12) and located in the first chamber (14)... a second capillary structure disposed on the second lower cover and located in the second chamber... a plurality of first capillary structures that are accommodated in the second chamber
Implementation Method 2
heat dissipation components that use the phase change of the working fluid to promote heat conduction... achieve the purpose of transferring heat through the phase change and flow direction of the working fluid
Implementation Method 3
the first lower cover (12) is used to contact a heat source... promote heat conduction
Implementation Method 4
transfer heat through the phase change and flow direction of the working fluid
Data Source
AI summary
A heat dissipation device is provided and includes: a first vapor chamber having a first chamber and two first openings; and a second vapor chamber disposed on the first vapor chamber and having a second chamber, two bending portions and a middle portion. The two bending portions are inserted into the two first openings respectively to connect the first vapor chamber, such that the second chamber is in communication with the first chamber.