Net Spacer for 3D IC Package Structural Support
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Solution Overview
Problem
Integrated circuit package systems face challenges such as bulky configurations, substrate warpage, electrical shorting, alignment difficulties, delamination, and chip floating due to low viscosity adhesives, which increase fabrication complexities and costs.
Innovation Solution
A strip level net spacer with support bars, tie bars, and paddles is used to provide structural support to vertically stacked semiconductor devices, reducing the overall stack-up height and eliminating costly process steps by consolidating individual unit level spacer attach processes into a single step.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If low viscosity adhesives are used for stacking semiconductor devices, then easier alignment and attachment are achieved, but substrate warpage, delamination, and chip floating problems occur
Solution Approach 1:
A net spacer structure is introduced as an intermediary component between the substrate and stacked semiconductor devices. The net spacer provides mechanical support and distributes stress, preventing substrate warpage, delamination, and chip floating while maintaining the ease of alignment and attachment provided by low viscosity adhesives.
Solution Approach 2:
The support structure is segmented into a net spacer configuration with multiple bars and open regions, rather than using a continuous adhesive layer. This segmentation allows the structure to provide support while accommodating thermal expansion and stress distribution, preventing warpage and delamination.
2Reliability
If individual unit level spacers are used for each semiconductor device, then structural support is provided, but fabrication complexity and production time increase
Solution Approach 1:
Multiple individual unit level spacers are merged into a single integrated net spacer structure that spans across multiple semiconductor devices. This consolidation provides structural support for all devices simultaneously, reducing fabrication complexity and production time while maintaining the necessary structural support.
3Reliability
If traditional packaging methods are used, then electrical interconnections are established, but circuit length, failure points, resistance, and cross-talk increase
Solution Approach 1:
The patent transitions from traditional planar packaging to three-dimensional stacked packaging with the net spacer enabling vertical stacking of semiconductor devices. This dimensional change significantly reduces circuit length by allowing direct vertical interconnections, thereby reducing failure points, resistance, and cross-talk while maintaining reliable electrical interconnections.
Data Source
AI summary
A method for manufacturing an integrated circuit package system is provided including: forming a strip level net spacer including support bars, tie bars and paddles; configuring the support bars, the tie bars and the paddles to form four or more open regions around each of the paddles; and interconnecting the support bars, the tie bars and the paddles to provide structural support to vertically stacked semiconductor devices formed above first semiconductor devices and directly attached to the paddles.