Network Addressable Lighting Device Power Data Separation
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Solution Overview
Problem
Existing networked devices face challenges in separating differential-pair controlled impedance structures from power structures to reduce electromagnetic interference and electromagnetic coupling, especially in compact designs where physical distance is limited, leading to signal imperfections and high costs for specialized connectors.
Innovation Solution
A design that separates power and data structures by receiving power from a PoE device at a physical interface and data assembly, converting power rails on a separate power assembly, and using low-cost conventional board stacker connectors, while keeping high-speed data lines on the data assembly to minimize electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If power and data structures are placed close together in a compact device, then device size is reduced, but electromagnetic interference and signal imperfections increase
Solution Approach 1:
The device is divided into separate power and data assemblies (PCAs) that are physically separated to reduce electromagnetic interference. The power assembly handles high-current power conversion while the data assembly handles sensitive communications, with each assembly being independently designed and connected through standardized interfaces.
2Object-affected harmful factors
If separate power and data assemblies are used to reduce electromagnetic interference, then electromagnetic coupling is reduced, but device complexity increases
Solution Approach 1:
Standardized board-to-board stacker connectors are used to interconnect the power and data assemblies, providing universal interfaces that simplify assembly and reduce design complexity. These standardized connectors handle both power and data signals through well-defined protocols, making the system easier to manufacture and service despite the physical separation of functions.
3Manufacturing precision
If specialized high-speed matched impedance connectors are used to maintain signal integrity between assemblies, then signal quality is improved, but manufacturing cost increases
Solution Approach 1:
The design uses conventional, low-cost board-to-board stacker connectors instead of expensive high-speed matched impedance connectors. While stacker connectors are not optimized for high-speed differential signals, the design compensates through careful signal routing and impedance control on the PCBs themselves, achieving acceptable signal integrity at a fraction of the cost of specialized connectors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for a compact, low-cost device with reduced electromagnetic interference and electromagnetic coupling, using low-cost connectors and maintaining signal integrity by isolating power and data structures effectively.
Implementation Method 1
a first power conversion element configured to convert the power to a first voltage that is appropriate for powering the driver
Implementation Method 2
a second power conversion element to convert the power to a second voltage that is appropriate for the at least one logic element
Data Source
AI summary
An network addressable lighting device that receives the input power from a power source (PSE), such as a network Power Over Ethernet (PoE) source, at a physical interface and data assembly PIDA and passes the signal directly to a second power assembly (PA) while the AC coupled high-speed data lines stay exclusively on the PIDA that contains the input and output physical interfaces, such as RJ interfaces. All power rails required to run the PIDA are converted on the PA and can then be sent back to the PIDA via low-cost conventional board stacker connectors. Movement of the high-current is done on the power assembly and not the data assembly where the sensitive communications primarily occur. The implementations thus provide an ideal separation of power and data structures to reduce EMI/EMC issues in a low cost and compact device.